2017
DOI: 10.1088/1361-6595/aa6a7d
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In situplasma sputtering and angular distribution measurements for structured molybdenum surfaces

Abstract: We present in situ sputtering yield measurements of the time-dependent erosion of flat and micro-architectured molybdenum samples in a plasma environment. The measurements are performed using the plasma interactions (Pi) Facility at UCLA, which focuses a magnetized hollow cathode plasma to a material target with an exposure diameter of approximately 1.5 cm. During plasma exposure, a scanning quartz crystal microbalance (QCM) provides angular sputtering profiles that are integrated to estimate the total sputter… Show more

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Cited by 15 publications
(6 citation statements)
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“…The sputtering thresholds and the dependences of the metal sputtering rate on the ion energy can be estimated from the data obtained in experiments with Ar + ion beams [8][9][10], as well as from the data of sputtering modelling by the molecular dynamics method, or from calculations using the semiempirical equations of Tawara et al [11][12][13]. The dependences of the sputtering yield of Mo, W, Ru and Au on the energy of Ar + ions (E i = 50-200 eV) determined in such experiments were in good agreement with the calculated data [4,8,9]. However, in plasma, the sputtering yield Y of materials may differ from the calculated value due to possible effects of redeposition [14].…”
Section: Introductionsupporting
confidence: 61%
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“…The sputtering thresholds and the dependences of the metal sputtering rate on the ion energy can be estimated from the data obtained in experiments with Ar + ion beams [8][9][10], as well as from the data of sputtering modelling by the molecular dynamics method, or from calculations using the semiempirical equations of Tawara et al [11][12][13]. The dependences of the sputtering yield of Mo, W, Ru and Au on the energy of Ar + ions (E i = 50-200 eV) determined in such experiments were in good agreement with the calculated data [4,8,9]. However, in plasma, the sputtering yield Y of materials may differ from the calculated value due to possible effects of redeposition [14].…”
Section: Introductionsupporting
confidence: 61%
“…The processes of low-energy (Е i < 200 eV) sputtering of materials by ions of inert gases, such as Ar + , are widely applied in various fields of nanotechnology. They are used for surface modification, formation of nanostructures and for determination of the erosion rate in plasma of metallic optical and protective coatings [1][2][3][4]. In modern technology of nanoelectronics, low-energy ion-plasma sputtering is a crucial stage of the developed multistage processes of atomiclayer etching (ALE) of materials [5][6][7].…”
Section: Introductionmentioning
confidence: 99%
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“…Then the mass increase by sputtered atoms sticking to the catcher QCM can be measured (Berger et al, 2017). Such a setup can also give insights into the angular distribution of sputtered particles (see Li et al [2017] for measurements with structured molybdenum surfaces, and Stadlmayr et al [2020] for experiments with highly porous tungsten fuzz structures).…”
Section: Quartz Crystal Microbalance Samplesmentioning
confidence: 99%
“…Textured surfaces have been shown experimentally [12][13][14] and computationally [15,16] to suppress SEE by capturing emitted and backscattered secondary electrons. This suppression is due to geometric effects and can also be observed in sputtering of featured surfaces exposed to plasma [17][18][19]. In electric propulsion devices, carbon velvet has been used to improve performance; a similar effect could be realized in fusion devices via surface fuzz formation at the divertor plate.…”
Section: Introductionmentioning
confidence: 99%