Hydrogen Ion Implantation Induced Cutting Behavior Variation in Plunge Cutting of the Monocrystalline Silicon

Zhao, Ze; Jelenković, Emil V.; Xiao, Gao; Zhuang, Zhuoxuan; To, Suet

doi:10.1007/s41871-020-00086-z

Cited by 6 publications

(1 citation statement)

References 26 publications

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“…Mechanical machining is a more powerful and feasible method to machine singlecrystal silicon [8,9]. However, subsurface damage results because of the toolworkpiece contact during machining, which affects the mechanical, electronic, and optical performance of silicon-based devices.…”

Section: Introductionmentioning

confidence: 99%

Study on the Vertical Ultrasonic Vibration-Assisted Nanomachining Process on Single-Crystal Silicon

Wang

Geng

Yan

et al. 2021

Journal of Manufacturing Science and Engineering

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Subsurface damage that is caused by mechanical machining is a major impediment to the widespread use of hard–brittle materials. Ultrasonic vibration-assisted macro- or micromachining could facilitate shallow subsurface damage compared with conventional machining. However, the subsurface damage that was induced by ultrasonic vibration-assisted nanomachining on hard–brittle silicon crystal has not yet been thoroughly investigated. In this study, we used a tip-based ultrasonic vibration-assisted nanoscratch approach to machine nanochannels on single-crystal silicon, to investigate the subsurface damage mechanism of the hard–brittle material during ductile-machining. The material removal state, morphology, and dimensions of the nanochannel, and the effect of subsurface damage on the scratch outcomes were studied. The materials were expelled in rubbing, plowing, and cutting mode in sequence with an increasing applied normal load and the silicon was significantly harder than the pristine material after plastic deformation. Transmission electron microscope analysis of the subsurface demonstrated that ultrasonic vibration-assisted nanoscratching led to larger subsurface damage compared with static scratching. The transmission electron microscopy results agreed with the Raman spectroscopy and molecular dynamic simulation. Our findings are important for instructing ultrasonic vibration-assisted machining of hard–brittle materials at the nanoscale level.

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Section: Introductionmentioning

confidence: 99%

Study on the Vertical Ultrasonic Vibration-Assisted Nanomachining Process on Single-Crystal Silicon

Wang

Geng

Yan

et al. 2021

Journal of Manufacturing Science and Engineering

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Effect of temperature on ductile-to-brittle transition in diamond cutting of silicon

Liu

et al. 2021

Int J Adv Manuf Technol

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High-efficient fabrication of infrared optics with uniform microstructures by a semi-ductile diamond milling approach

Wang

et al. 2023

Int J Adv Manuf Technol

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Hydrogen Ion Implantation Induced Cutting Behavior Variation in Plunge Cutting of the Monocrystalline Silicon

Cited by 6 publications

References 26 publications

Study on the Vertical Ultrasonic Vibration-Assisted Nanomachining Process on Single-Crystal Silicon

Study on the Vertical Ultrasonic Vibration-Assisted Nanomachining Process on Single-Crystal Silicon

Effect of temperature on ductile-to-brittle transition in diamond cutting of silicon

High-efficient fabrication of infrared optics with uniform microstructures by a semi-ductile diamond milling approach

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