Effect of temperature on ductile-to-brittle transition in diamond cutting of silicon

He, Wenbin; Liu, Changlin; Xu, Guang; Zhang, Jianguo; Xiao, Junfeng; Chen, Xiao

doi:10.1007/s00170-021-07701-3

Cited by 10 publications

(2 citation statements)

References 44 publications

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“…This, in turn, led to a significant enhancement in the surface quality of the workpiece. Ke et al [80,88] used a self-developed In-LAC system to study the machining performance of silicon. They discovered that In-LAC can greatly enhance the material's flexibility and workability [89], and the DBT depth of silicon was raised by 364% compared with OC.…”

Section: Types Of Lacmentioning

confidence: 99%

Field-assisted machining of difficult-to-machine materials

Zhang,

Zheng,

Huang

et al. 2024

Int. J. Extrem. Manuf.

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Difficult-to-machine materials (DMMs) are extensively applied in critical fields such as aviation, national defense, biomedicine, and other key fields due to their excellent material properties. However, traditional machining technology is difficult to precisely machine DMMs due to poor surface quality and low processing efficiency. In recent years, as a new generation of machining technology, field-assisted machining (FAM) technology based on innovative principles such as laser heating, tool vibration, magnetic magnetization, and plasma modification provides a new solution for improving the machinability of DMMs. It is advantageous to prevent the shortcomings of traditional machining methods, and has become a hot topic of research in the domain of ultra-precision machining of DMMs. Many new methods and principles have been presented and investigated one after another, yet few researches have been analysed and summarized from a comprehensive standpoint. To fill this gap and understand the development trend of FAM, this study provides an important overview of FAM, covering different assisted machining methods, application effects, mechanism analysis, and equipment design. The current deficiencies and future challenges of FAM are summarized to lay the foundation for the further development of multi-field hybrid assisted and intelligent field-assisted machining technologies.

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Section: Types Of Lacmentioning

confidence: 99%

Field-assisted machining of difficult-to-machine materials

Zhang,

Zheng,

Huang

et al. 2024

Int. J. Extrem. Manuf.

Self Cite

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show abstract

“…However, the FE simulation of in-situ laser-assisted cutting of monocrystalline silicon is rarely reported. Recently, He et al [21] investigated the In-LAT of monocrystalline silicon by developing a smoothed particle hydrodynamics model based on the Johnson-Cook (J-C) constitutive model considering temperature effects. They found that the formed temperature field leads to reduced cutting force and increased critical DOC for the BDT.…”

Section: Introductionmentioning

confidence: 99%

Finite element simulation and experimental investigation of in-situ laser-assisted diamond turning of monocrystalline silicon

Hu,

Zhao,

Sun

et al. 2024

Semicond. Sci. Technol.

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While the effectiveness of in-situ laser-assisted diamond turning (In-LAT) for promoting the ductile machinability of monocrystalline silicon has been demonstrated, the underlying cutting mechanisms remain inadequately understood. In this study, we investigate the fundamental mechanisms involved in the In-LAT of monocrystalline silicon by finite element simulations and experiments. Specifically, a finite element model of In-LAT of monocrystalline silicon is developed, which incorporates a Drucker-Prager constitutive model to address the brittle fracture of the material, as well as temperature-dependent materials properties to address the thermal softening effect. Furthermore, experiments of In-LAT of monocrystalline silicon are conducted with the self-developed In-LAT device, including tapering cutting and end face cutting. Simulation results demonstrate that In-LAT significantly increases the critical depth of cut for the brittle-to-ductile transition of monocrystalline silicon in tapering cutting mode by 72.2% compared to conventional cutting, accompanied with significantly reduced cutting forces, continuous chip profile and reduced surface brittle damage. The promotion of ductile machinability of monocrystalline silicon under In-LAT is attributed to the reduction and dispersion of stress in the cutting zone, which is in contrast to the significant stress concentration at the rake face and cutting edge in conventional cutting. And simulation results also provide an optimal temperature field of 900 K for the In-LAT of monocrystalline silicon, above which the excessive plastic flow accompanied by thermal accumulation results into deteriorated surface roughness. These findings provide valuable insights for understanding the cutting mechanisms of In-LAT and the parameter optimization for In-LAT application.

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Sustainability of Methods for Augmented Ultra-Precision Machining

Lee,

Wang

2023

Int. J. of Precis. Eng. and Manuf.-Green Tech.

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Effect of temperature on ductile-to-brittle transition in diamond cutting of silicon

Cited by 10 publications

References 44 publications

Field-assisted machining of difficult-to-machine materials

Field-assisted machining of difficult-to-machine materials

Finite element simulation and experimental investigation of in-situ laser-assisted diamond turning of monocrystalline silicon

Sustainability of Methods for Augmented Ultra-Precision Machining

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