Hybrid Stacked RFID Antenna Coil Fabricated by Ink Jet Printing of Catalyst with Self-assembled Polyelectrolytes and Electroless Plating

Wang, Chung-Wei; Mo-hua, Yang; Lee, Yuh-Zheng; Cheng, Kevin

doi:10.2352/j.imagingsci.technol.(2007)51:5(452)

Cited by 9 publications

(8 citation statements)

References 7 publications

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“…On the basis of our experiences, we initially identified nine variables having the potential to affect the Cu plating process and therefore also the electrical resistance of the plated Cu features. These included: (1) fluoboric acid "acceleration" pretreatment of the Pd/Sn patterns prior to EL Cu plating; (2) concentration of the EL Cu bath; (3) surface coverage (i.e., loading) of the Pd/Sn colloidal catalyst on the paper surface; (4) the dimensions (i.e., length and width) of the Pd/Sn catalyst lines on the paper; (5) the spacing of the Pd/Sn catalyst lines on the paper; (6) the type of paper plated; (7) the age of the Pd/Sn catalyst lines; (8) plating time in the EL Cu bath, and; (9) the temperature of the EL Cu bath.…”

Section: ■ Results and Discussionmentioning

confidence: 99%

Statistical Analysis of Plating Variable Effects on the Electrical Conductivity of Electroless Copper Patterns on Paper

Zabetakis

Dressick

2012

ACS Appl. Mater. Interfaces

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We describe a process for selective metallization of paper substrates bearing inkjet printed patterns of a commercial Pd/Sn colloidal catalyst ink plated using a commercial electroless Cu bath. The electrical conductivity of the Cu films is analyzed as a function of feature geometry (line dimensions (L) and spacing (S)), type of paper (P), age of the Pd/Sn patterns (A), plating time (T), and plating temperature (H) using a two-level factorial design. Conductivity is influenced predominantly by the P, T, and H factors, with lesser contributions attributed to pair-wise interactions among several of the variables studied. Increases in T and/or H enhance conductivity of the Cu films, whereas increases in P, corresponding to the use of rougher, more porous, paper substrates, yield Cu films exhibiting decreased conductivity. Our analysis leads to a model that predicts Cu film conductivity well over the ranges of variables examined, provides guidelines for identification of optimum conditions for plating highly conductive Cu films, and identifies areas for further process improvement.

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Section: ■ Results and Discussionmentioning

confidence: 99%

Statistical Analysis of Plating Variable Effects on the Electrical Conductivity of Electroless Copper Patterns on Paper

Zabetakis

Dressick

2012

ACS Appl. Mater. Interfaces

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“…Sintering free, high conductivity and the usage of non-noble metal as conductive material are the strengths of this process. But the poor adhesion of the patterns is the major problem for the lack of interaction between catalyst and polymer substrate [23][24][25][26][27]. Self-assembly of polyelectrolyte, surface grafting of polymer, surface modification of coupling agent, etc.…”

Section: Introductionmentioning

confidence: 99%

Selective adsorption of catalyst and copper plating for additive fabrication of conductive patterns and through-holes

Chang

Tao

Zhang

et al. 2015

Electrochimica Acta

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“…The applicaiotn of plastic to function fabrication of electronic devices such as radio-frequency identification (RFID) tag, sensor, antenna, and high precision metal pattern [1][2][3][4] in recent year. However, most of plastic are lack of electric conductivity.…”

Section: Introducsionmentioning

confidence: 99%

The inkjet printing of catalyst Pd ink for selective metallization apply to product antenna on PC/ABS substrate

Wang

Nian

Luo

et al. 2013

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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In this paper, a simple and effective method to fabricate conductive antenna metal pattern on plastic substrates PC/ABS (poly(carbonate/Acrylonitrile-Butadiene-Styrene)) is described. This methods involves inkjet printing of copolymer/noble metal nanopartical-based ink on a PC/ABS substrate to create the catalyst site, onto which is subsequently deposited by an electroless plating method, to obtain metal pattern. The main challenge in electroless plating on plastics is to establish a good adhesion between the substrate and metallic film. The PC/ABS substrate was etching by environmental friendly etching solution, after printing, the plastic were immersed in an electroless plating bath to deposition Ni-P pattern. The prepared nickel film thickness is 11µm, which is excellent adhesion of the deposited Ni-P coating to the substrate according to ASTM D3359-78. Finally, a WWAN antenna was formed then test the Radiation characteristics. INTRODUCSIONThe applicaiotn of plastic to function fabrication of electronic devices such as radio-frequency identification (RFID) tag, sensor, antenna, and high precision metal pattern [1][2][3][4] in recent year. However, most of plastic are lack of electric conductivity. Therefore, fabrication metal onto polymer surface is necessary and unavoidable before their application, the technology of deposition metal on a plastic substrate has been tremendous attention. There's many deposition process to formed metal on substrate, such as photolithography and chemical vapor deposition(CVD) [5][6][7][8].Although photolithography could create high resolution metal line, but employ environmentally unfriendly chemicals would formed in the process. Most of substrate can't stand the high temperature in CVD process; both of them are high cost, complexity, and time-consuming. Printing technology has been gradually forward to unconventional, such as microcontact printing (μCP) [13][14][15], and ink-jet print [16][17][18], these print method always combines with electorless deposition, by controlling the position of activation place can selective decide the metal crystals grow and deposition. Electroless deposition is a stable and has been used in many process, this method without high cost equipment, and deposition at low temperature[9-12] is commonly used as a way. The general process of electroless deposition involves preparation of surface, activation by catalyst metal particaleson desire place, and immersed in electroless bath to deposition metal on the substrate, then metallization on the non-conductive substrate. It can also addition metal thickness follow by electroless to fabricate a smooth surface.The main challenge in electroless plating on plastics is to establish a good adhesion between the substrate and metallic film. The general methods for PC/ABS surface etching involves the chromic acid (H 2 CrO 4 ) solution, becaucse the carcinogen chrominum ion (Cr 6+ ) could impose serious environmental threat, more and more environmental friendly etching system has increased and the search for a re...

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Hybrid Stacked RFID Antenna Coil Fabricated by Ink Jet Printing of Catalyst with Self-assembled Polyelectrolytes and Electroless Plating

Cited by 9 publications

References 7 publications

Statistical Analysis of Plating Variable Effects on the Electrical Conductivity of Electroless Copper Patterns on Paper

Statistical Analysis of Plating Variable Effects on the Electrical Conductivity of Electroless Copper Patterns on Paper

Selective adsorption of catalyst and copper plating for additive fabrication of conductive patterns and through-holes

The inkjet printing of catalyst Pd ink for selective metallization apply to product antenna on PC/ABS substrate

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