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Summary: The driving forces behind the development of flexible electronics are their flexibility, lightweightedness, and potential for low‐cost manufacturing. However, because of physical limitations, traditional thermal processes cause deformations in the flexible substrate. As a result, the adhesion quality of the printed wires is deteriorated. This article reviews recent developments in printing circuits on a flexible substrate by combining self‐assembled polyelectrolytes, ink‐jet printing of a catalyst, and electroless plating of metals. The limitations and potential applications of this technology are also discussed. Experiments implementing this technology demonstrated significant results. By a vibration‐induced assistance during an ink‐jet printing catalyst process, line width and blurring can be controlled to within ±3% variation. Following the IPC 6013 standard for flexible electronics, the results after thermal cycling (288 °C, 6 times) and a hot oil test (260 °C, 3 times) indicated that the metallic circuit had retained excellent adhesion properties and electric characteristics. We also report the first successful demonstration of a metal film in a via‐hole inner wall on a flexible substrate. This novel fabrication method is ideal for the realization of large area, flexible electronics and future multilayer flexible substrate application, such as flexible display, chip on flexible substrate, etc., particularly where traditional lithographic processes can not be applied.Flexible high‐density circuit on an FR‐4 substrate (left) and picture of via hole with copper inner wall (right).magnified imageFlexible high‐density circuit on an FR‐4 substrate (left) and picture of via hole with copper inner wall (right).

The understanding of cycling and electrochemical characteristics of Si particle anodes for Li-ion batteries has previously been hindered by very fast capacity fading. Optimizing the electrode architecture to significantly improve its stability up to the 1000mAh∕g charge-discharge level has made it possible to investigate these properties to a greater depth than before. The capacity fading and lithiation mechanisms of Si and C-coated Si particles have been studied in this paper by cycling test and electrochemical impedance spectroscopy (EIS) analysis. The capacity vs cycle number plot exhibits two regions of different fading rates, including an initial region of slow fading followed by accelerated decay. The latter may be associated with large-scale failure of the electrode structure. EIS revealed a core-shell lithiation mechanism of Si. C-coating not only exerts remarkable favorable effects against capacity fading, but also serves as a conduit for Li ions to the reaction with Si particles.