Hybrid Photonic Integration on a Polymer Platform

Zhang, Ziyang; Felipe, David de; Katopodis, V.; Groumas, Panos; Kouloumentas, Christos; Avramopoulos, H.; Dupuy, Jean-Yves; Konczykowska, A.; Dede, Alberto; Beretta, A.; Vannucci, A.; Cangini, G.; Dinu, Raluca; Schmidt, D.; Moehrle, Martin G.; Runge, Patrick; Choi, Jung-Won; Bach, H.-G.; Grote, N.; Keil, Norbert; Schell, Martin

doi:10.3390/photonics2031005

Cited by 47 publications

(41 citation statements)

References 41 publications

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“…The conventional method of experimental noise reduction through the interference between a signal and its phase-conjugate replica (e.g., [20,28,29] relies on parametric conversions of photons in χ (2) and χ (3) -based materials. These techniques, however, constitutes only a particular case of a broader picture of parametric processes.…”

Section: Discussion-physical Aspects Of Ps Gain Coefficientsmentioning

confidence: 99%

“…In the previous two sections, we have identified the parametric phase-dependent gain coefficient and the related parametric phase-pulling effect as fundamental mechanisms underpinning two-photon output per interaction for χ (2) and χ (3) parametric processes for any level of optical powers and conditions. In this section, we consider the possibility of generating sub-Poissonian distributions of photons with the assistance of optically linear parametric (OLP) [6] and electro-optic parametric (EOP) [7] interactions, which involve only one-photon output per interaction-with one-photon input-although the EOP conversion requires one microwave photon.…”

Section: Simultaneous Amplification Of a Signal And Sub-poissonian DImentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

“…Integrated photonic platforms [1][2][3] will contain their own low-power optical sources, which will be used for on-chip signal processing. However, the low levels of power rule out any significant nonlinear effects for χ (2) and χ (3) , the second-and third-order susceptibilities. For instance, a recently reported phase-sensitive amplifier [4] operating on χ (3) in semiconductor materials can only deliver output signal powers of less than −31 dBm for input pump powers of −1 dBm.…”

Section: Introductionmentioning

confidence: 99%

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Photonic Quantum Noise Reduction with Low-Pump Parametric Amplifiers for Photonic Integrated Circuits

Vatarescu¹

2016

Photonics

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An approximation-free and fully quantum optic formalism for parametric processes is presented. Phase-dependent gain coefficients and related phase-pulling effects are identified for quantum Rayleigh emission and the electro-optic conversion of photons providing parametric amplification in small-scale integration of photonic devices. These mechanisms can be manipulated to deliver, simultaneously, sub-Poissonian distributions of photons as well as phase-dependent amplification in the same optical quadrature of a signal field.

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Section: Discussion-physical Aspects Of Ps Gain Coefficientsmentioning

confidence: 99%

Section: Simultaneous Amplification Of a Signal And Sub-poissonian DImentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Photonic Quantum Noise Reduction with Low-Pump Parametric Amplifiers for Photonic Integrated Circuits

Vatarescu¹

2016

Photonics

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“…Another benefit of polymers is the ease of processing for various devices [156]. A polymer-based hybrid photonic integration platform was developed recently [157]. Such platform mainly used UV-curable epoxy resins and provided flexible optical I/O interfaces coupled with InP active components, film-based optical elements, and on-chip optical fibers.…”

Section: Cost Reduction Approachesmentioning

confidence: 99%

Low-Temperature Bonding for Silicon-Based Micro-Optical Systems

Howlader

Deen

2015

Photonics

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Abstract:Silicon-based integrated systems are actively pursued for sensing and imaging applications. A major challenge to realize highly sensitive systems is the integration of electronic, optical, mechanical and fluidic, all on a common platform. Further, the interface quality between the tiny optoelectronic structures and the substrate for alignment and coupling of the signals significantly impacts the system's performance. These systems also have to be low-cost, densely integrated and compatible with current and future mainstream technologies for electronic-photonic integration. To address these issues, proper selection of the fabrication, integration and assembly technologies is needed. In this paper, wafer level bonding with advanced features such as surface activation and passive alignment for vertical electrical interconnections are identified as candidate technologies to integrate different electronics, optical and photonic components. Surface activated bonding, superior to other assembly methods, enables low-temperature nanoscaled component integration with high alignment accuracy, low electrical loss and high transparency of the interface. These features are preferred for the hybrid integration of silicon-based micro-opto-electronic systems. In future, new materials and assembly technologies may emerge to enhance the performance of these micro systems and reduce their cost. The article is a detailed review of bonding techniques for electronic, optical and photonic components in silicon-based systems.

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