To fulfill the functionality demands from the fast developing optical networks, a hybrid integration approach allows for combining the advantages of various material platforms. We have established a polymer-based hybrid integration platform (polyboard), which provides flexible optical input/ouptut interfaces (I/Os) that allow robust coupling of indium phosphide (InP)-based active components, passive insertion of thin-film-based
We demonstrate the first integrated transmitter for serial 100 Gb/s NRZ-OOK modulation in datacom and telecom applications. The transmitter relies on the use of an electro-optic polymer modulator and the hybrid integration of an InP laser diode and InP-DHBT electronics with the polymer board. Evaluation is made at 80 and 100 Gb/s through eye-diagrams and BER measurements using a receiver module that integrates a pin-photodiode and an electrical 1:2 demultiplexer. Error-free performance is confirmed both at 80 and 100 Gb/s revealing the viability of the approach and the potential of the technology.
We report on the monolithic integration of multimode interference couplers, Bragg gratings, and delay-line interferometers on an electro-optic polymer platform capable of modulation directly at 100 Gb/s. We also report on the hybrid integration of InP active components with the polymer structure using the butt-coupling technique. Combining the passive and the active components, we demonstrate a polymer-based, external cavity laser with 17 nm tuning range and the optical assembly of an integrated 100 Gb/s transmitter, and we reveal the potential of the electro-optic polymer technology to provide the next generation integration platform for complex, ultra-high-speed optical transceivers.
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