2015 IEEE International Integrated Reliability Workshop (IIRW) 2015
DOI: 10.1109/iirw.2015.7437086
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Hot Carrier Stress modeling: From degradation kinetics to trap distribution evolution

Abstract: A complete TCAD model addressing Hot Carrier Degradation for Flash technology is presented. After having underlined the need for a power law with a low exponent for the aging kinetics and considered a high activation energy reflecting the single electron impact mode, a fine calibration is achieved. Finally, analysis on trap distribution and aging rates at different channel locations are provided

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