Highly-sensitive novolak-based positive X-ray resist

Dössel, K.-F.; Huber, H.-L.; Oertel, H.

doi:10.1016/0167-9317(86)90035-3

Cited by 28 publications

(4 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…For example, in the above Novolac/DNQ system, when the photosensitive inhibitor, DNQ, was replaced by a PAG and a dissolution inhibitor that can undergo an acid-catalyzed deprotection reaction a sensitivity of less than 50mJ/cm 2 was achieved with high resolution. [80,82] Negative-tone systems consisting of a novolac resin, a PAG and a crosslinker (such as hexa(methoxymethyl)melamine) have also shown enhanced sensitivity. [83] Most of the X-ray resists used today are commercially available chemically amplified systems based on novolac or PHS.…”

Section: X-ray Lithographymentioning

confidence: 98%

“…Another type of e-beam resist, poly(butene-sulfone) (PBS) shows improved sensitivity but still has a very low etch resistance. [80] For negative tone imaging, poly(chloromethylstyrene) (PCMS) type resists have showed enhanced performance. For example, chlorinated polymethylstyrene has a sensitivity of 17mJ/cm 2 under X-ray radiation (λ=0.5nm).…”

Section: X-ray Lithographymentioning

confidence: 99%

See 1 more Smart Citation

The convergence of top-down and bottom-up nanofabrication: formation of 3D structures

Yang

Dai

et al. 2005

SPIE Proceedings

View full text Add to dashboard Cite

Lithography and the processes associated with it are the backbone of the nanotechnology revolution. Several developments are occurring simultaneously: a drive to reduce minimum feature size leading to advances in microelectronics, the use of lithographically patterned structures to prepare devices for photonics, biotechnology and other forms of nanotechnology and finally the drive to create three-dimensional (3D) structures for device and new materials creation. Thus the controlled formation of nanometer scale structures in two and three dimensions is of increasing interest in many applications. This paper will overview new approaches for the construction of small-scale structures using methods generally considered as next generation lithography. New approaches derived from two photon processes for the formation of complex images and the development of patterned structures will be described. Finally in the production of 3D patterns, the possible role of self-assembly coupled to lithography will be examined. Photodefinable block copolymers with erodable microstructures have been successfully used to form mesoporous materials and will be discussed.

show abstract

Section: X-ray Lithographymentioning

confidence: 98%

Section: X-ray Lithographymentioning

confidence: 99%

The convergence of top-down and bottom-up nanofabrication: formation of 3D structures

Yang

Dai

et al. 2005

SPIE Proceedings

View full text Add to dashboard Cite

show abstract

“…Significant advances in the design of chemically amplified resists (CAR) make them one of the most promising candidates for submicron deep-UV, e-beam and X-ray lithographies [1][2][3][4][5][6][7][8]. Several negative tone CAR's are commercially available and have demonstrated high sensitivity, with resolution capable of delineating 0.25 m pattern with high fidelity.…”

Section: Introductionmentioning

confidence: 99%

<title>Prebake and post-exposure bake effects on the dissolution of AZ-PF</title>

Krasnoperova

Reilly

Turner

et al. 1993

Advances in Resist Technology and Processing X

View full text Add to dashboard Cite

We have performed ezperiments to study the kinetics of dissolution of the positive chemically amplified resist AZ-PF (Hoechst AG). The resist dissolution in exposed regions was shown to have non-linear time dependence, with a delay time strongly dependent on prebake and post-exposure bake conditions. Effect of the presence of a low-solubility surface layer on patterning of submicron features as well as on roughness of the developed film has been demonstrated.

show abstract

“…4 We have previously described the use of 2-nitrobenzyl sulfonate esters as covalent, highly soluble, nonmetallic photogenerators of tosic acid.6-7 Other workers have reported covalent compounds capable of photogenerating nonactivated aryl sulfonic acids,8-11 methanesulfonic acid,12 and hydrogen halides. 13,14 However, these systems all release acids having relatively nucleophilic anions compared with hexafluoroarsenic and f Barnard College, New York. triflic acid, which can be formed by the irradiation of onium salts.…”

Section: Introductionmentioning

confidence: 99%

Photoconductor fatigue. 1. Photochemistry of hydrazone-based hole-transport molecules in organic layered photoconductors: spectroscopic characterization and effect on electrical properties

Pacansky¹,

Waltman²,

Grygier³

et al. 1991

Chem. Mater.

View full text Add to dashboard Cite

Highly-sensitive novolak-based positive X-ray resist

Cited by 28 publications

References 1 publication

The convergence of top-down and bottom-up nanofabrication: formation of 3D structures

The convergence of top-down and bottom-up nanofabrication: formation of 3D structures

<title>Prebake and post-exposure bake effects on the dissolution of AZ-PF</title>

Photoconductor fatigue. 1. Photochemistry of hydrazone-based hole-transport molecules in organic layered photoconductors: spectroscopic characterization and effect on electrical properties

Contact Info

Product

Resources

About