Highly Selective Determination of Copper Corrosion Products by Voltammetric Reduction in a Strongly Alkaline Electrolyte

Regenerative Electrocatalytic Redox Cycle of Copper Sulfide for Sustainable NH3 Production under Ambient Conditions

“…The regeneration of the Cu 9 S 5 structure from Cu 2 O can proceed by the following electrochemical oxidation reaction. It has been reported that the Cu substrate is oxidized to form Cu x S (including Cu 2 S and Cu 9 S 5 ) in the presence of sulfide in an aqueous electrolyte solution at potentials more positive than approximately −0.8 V RHE . In the previous study, a small bumpy current was recorded at around −0.8 V RHE in CV for Cu x S formation from Cu substrates. ,, Also, no large oxidative current was detected at the potentials around −0.8 V RHE from a CV in 50 mM Na 2 S using the degraded Cu 9 S 5 electrode (Figure f). The peaky oxidation current observed at −0.3 V RHE in Figure f is attributed to the S n 2– /S 2– redox reaction at Cu 9 S 5 surfaces .…”

“…55 In the previous study, a small bumpy current was recorded at around −0.8 V RHE in CV for Cu x S formation from Cu substrates. 55,56,5 Also, no large oxidative current was detected at the potentials around −0.8 V RHE from a CV in 50 mM Na 2 S using the degraded Cu 9 S 5 electrode (Figure 4f). The peaky oxidation current observed at −0.3 V RHE in Figure 4f is attributed to the S n 2− /S 2− redox reaction at Cu 9 S 5 surfaces.…”

“…The regeneration of the Cu 9 S 5 structure from Cu 2 O can proceed by the following electrochemical oxidation reaction. It has been reported that the Cu substrate is oxidized to form Cu x S (including Cu 2 S and Cu 9 S 5 ) in the presence of sulfide in an aqueous electrolyte solution at potentials more positive than approximately −0.8 V RHE . In the previous study, a small bumpy current was recorded at around −0.8 V RHE in CV for Cu x S formation from Cu substrates. ,, Also, no large oxidative current was detected at the potentials around −0.8 V RHE from a CV in 50 mM Na 2 S using the degraded Cu 9 S 5 electrode (Figure f).…”

Effect of Oxidation Temperature on Photo-catalytic Properties of Stainless Steel Coated by Copper Oxide

“…It suggested that copper oxide substance except Cu 2 O is also included in the Cu-oxide electrode with the oxidation temperature of 250°C. By double sweep cyclic voltammetry method (DSCV method), 33,34) CuO and Cu(OH) 2 in the Cu-oxide film were actually detected. The CuO contributes the potential ennoblement immediately after light irradiation.…”

Microstructure of TiCuO Films on Copper Ion Release and Endothelial Cell Behavior

“…发现钛及钛合金优良的血液相容性是由于其表面生 成的稳定氧化物二氧化钛的作用。黄楠等 [4][5] 研制得 到的氧化钛薄膜具有较好的生物相容性, 可以提高 316L SS 支架的耐腐蚀性、化学惰性和血液相容性。 但氧化钛薄膜还未达到理想的抗凝血要求, 服役期 间病人还需服用抗凝药。 金属 Cu 离子是人体必需的微量元素, 正常人 体中含有约 100~120 mg 的 Cu 元素 [6] 。 人体服用 Cu 的药用浓度高于 5.0 mg/kg 体重时才表现出毒性 [7] , Cu 还是人体生命过程中许多重要酶的活性中心 [8] 。 研究发现, 一定浓度的 Cu 离子可以促进内皮细胞 的 增 殖 , 但 并 不 促 进 平 滑 肌 和 成 纤 维 细 胞 的 增 殖 [9][10] , 还可以通过上调血管内皮生长因子的表达 来促进血管生成和血管成熟 [11] , 因此, 合金材料中 [12] 和抗菌性能 [13][14] 等, 很少有研究关注其内皮细胞相容性, 也较少有 [15] , [23][24] , 同时杂质元素会影响 Cu 的氧 化过程 [25] 。 本研究认为, [26,28,30] [31] , 并且在微摩尔浓度范围内的 Cu 离子可 以促进主动脉内皮细胞的增殖和迁移 [9,[31][32] [34][35] , 具有一定亲疏水平衡的表面最 有利于细胞生长 [36][37]…”