Microstructure of TiCuO Films on Copper Ion Release and Endothelial Cell Behavior

Abstract

TiCuO films with different microstructures and Cu contents were prepared on Si and 316L SS substrates using DC magnetron sputtering. The microstructure and chemical composition of the films were analyzed by X-ray diffraction (XRD), transmission electron microscopy (TEM), X-ray energy dispersive spectroscopy (EDS), and X-ray photoelectron spectroscopy (XPS). Corrosion behavior and Cu ions release properties of the films were evaluated by electrochemical corrosion and simulated body-fluid immersion tests, respectively. Endothelial cell (EC) viability on the films was evaluated by CCK-8 assay in vitro. Un-doped TiO 2 films exhibit rutile phases. After Cu incorporation, the TiCuO films consist of nano-crystalline grains of Cu 2 O on their amorphous matrix. The films with higher Cu contents are more susceptible to corrosion and release more Cu ions. The Cu-rich phases of the films result in corrosion.EC viability is enhanced by a certain concentration of Cu ions released from TiCuO films. All above results demonstrated that microstructures and Cu contents of TiCuO films play an important role in controlling copper ions release behaviors, and therefore affect the EC viability.