Highly moisture-resistive silicon nitride films prepared by catalytic chemical vapor deposition and application to gallium arsenide field-effect transistors
“…A low overall stress of several tens of MPa is also obtained in some conditions [10]. It was reported that the concentration of H atoms in the gas phase for the Cat-CVD process is much higher than that for the plasma-enhanced CVD (PECVD) process [11].…”
Section: Fundamental Properties Of Sin X Films Prepared By Cat-cvdmentioning
confidence: 93%
“…One of the most promising applications is passivation of compound-semiconductor devices. Passivation for GaAsbased transistors has been extensively studied for highelectron mobility transistors (HEMTs) [12] and field-effect transistors (FETs) [10,13]. The increase in sheet resistance for a two-dimensional electron-gas (2DEG) layer in HEMTs after SiN x passivation by Cat-CVD is only 1.5%, whereas that by PECVD is 12.4% [12].…”
Section: Applications To Coating and Passivation Filmsmentioning
confidence: 99%
“…The increase in sheet resistance for a two-dimensional electron-gas (2DEG) layer in HEMTs after SiN x passivation by Cat-CVD is only 1.5%, whereas that by PECVD is 12.4% [12]. From the drain-currentdrain-voltage (I d -V d ) characteristics for self-aligned gate FETs (SAGFETs) with passivation films by Cat-CVD or PECVD, it was found that the mutual conductance is improved from 15 mS to 22 mS using Cat-CVD instead of PECVD [10]. GaAs devices are easily damaged by charged particles in the plasma.…”
Section: Applications To Coating and Passivation Filmsmentioning
“…A low overall stress of several tens of MPa is also obtained in some conditions [10]. It was reported that the concentration of H atoms in the gas phase for the Cat-CVD process is much higher than that for the plasma-enhanced CVD (PECVD) process [11].…”
Section: Fundamental Properties Of Sin X Films Prepared By Cat-cvdmentioning
confidence: 93%
“…One of the most promising applications is passivation of compound-semiconductor devices. Passivation for GaAsbased transistors has been extensively studied for highelectron mobility transistors (HEMTs) [12] and field-effect transistors (FETs) [10,13]. The increase in sheet resistance for a two-dimensional electron-gas (2DEG) layer in HEMTs after SiN x passivation by Cat-CVD is only 1.5%, whereas that by PECVD is 12.4% [12].…”
Section: Applications To Coating and Passivation Filmsmentioning
confidence: 99%
“…The increase in sheet resistance for a two-dimensional electron-gas (2DEG) layer in HEMTs after SiN x passivation by Cat-CVD is only 1.5%, whereas that by PECVD is 12.4% [12]. From the drain-currentdrain-voltage (I d -V d ) characteristics for self-aligned gate FETs (SAGFETs) with passivation films by Cat-CVD or PECVD, it was found that the mutual conductance is improved from 15 mS to 22 mS using Cat-CVD instead of PECVD [10]. GaAs devices are easily damaged by charged particles in the plasma.…”
Section: Applications To Coating and Passivation Filmsmentioning
“…Silicon nitride (SiN x ) films prepared by catalytic chemical vapor deposition (Cat-CVD) method, which can be performed under 100°C without thermal damage to OLEDs, are expected to act as protection films for OLEDs due to the high film density [3][4][5][6]. However, moisture and oxygen can reach organic layers through cracks penetrating the SiN x films caused by roughness of underlying organic films or electrodes, which generates dark spots in OLEDs [7].…”
“…SiN x films prepared by Cat-CVD are more chemically stable, optically transparent and moisture-resistive compared to those prepared by plasma-enhanced CVD [1]. In Cat-CVD processes, source gas molecules are decomposed by catalytic cracking reactions on a heated catalyzer placed near the substrate [2].…”
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