High voltage electron beam lithography

Takigawa, Tadahiro; Kawabuchi, K.; Yoshimi, M.; Kato, Yoshihide

doi:10.1016/0167-9317(83)90025-4

Cited by 18 publications

(10 citation statements)

References 17 publications

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“…2c) and dense (Fig. 2d) pixel arrays, the EBL proximity effect 28 leads to variation in the final thickness values and hence spectral response for an identical dose range. We therefore determined an empirical correction (decrease) to the dose range in order to achieve the desired spectral response for dense pixel arrays (see Supplementary Note 2.2).…”

Section: Resultsmentioning

confidence: 96%

“…Transmission of up to ∼75% and relatively narrow full widths at half maximum (fwhm's) of ∼50 nm are observed in Figure 2b (i), with Δz thickness values up to ∼150 nm (Figure 2b, (ii)), in agreement with the simulation results (Figure 2a and Two different dose-modulated MIM arrays were then fabricated, clearly achieving varying colors as a result of variations in the cavity height. For isolated (Figure 2c) and dense (Figure 2d) pixel arrays, the EBL proximity effect 39 leads to variation in the final thickness values and hence spectral response for an identical dose range. We therefore determined an empirical correction (decrease) to the dose range in order to achieve the desired spectral response for dense pixel arrays (see SI Section S2 and Figures S6 and S7).…”

Section: ■ Results and Discussionmentioning

confidence: 99%

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Grayscale-to-Color: Scalable Fabrication of Custom Multispectral Filter Arrays

Williams¹,

Gordon²,

Gruber³

et al. 2019

ACS Photonics

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Snapshot multispectral image (MSI) sensors have been proposed as a key enabler for a plethora of multispectral imaging applications, from diagnostic medical imaging to remote sensing. With each application requiring a different set, and number, of spectral bands, the absence of a scalable, cost-effective manufacturing solution for custom multispectral filter arrays (MSFAs) has prevented widespread MSI adoption. Despite recent nanophotonic-based efforts, such as plasmonic or high-index metasurface arrays, large-area MSFA manufacturing still consists of many-layer dielectric (Fabry–Perot) stacks, requiring separate complex lithography steps for each spectral band and multiple material compositions for each. It is an expensive, cumbersome, and inflexible undertaking, but yields optimal optical performance. Here, we demonstrate a manufacturing process that enables cost-effective wafer-level fabrication of custom MSFAs in a single lithographic step, maintaining high efficiencies (∼75%) and narrow line widths (∼25 nm) across the visible to near-infrared. By merging grayscale (analog) lithography with metal–insulator–metal (MIM) Fabry–Perot cavities, whereby exposure dose controls cavity thickness, we demonstrate simplified fabrication of MSFAs up to N-wavelength bands. The concept is first proven using low-volume electron beam lithography, followed by the demonstration of large-volume UV mask-based photolithography with MSFAs produced at the wafer level. Our framework provides an attractive alternative to conventional MSFA manufacture and metasurface-based spectral filters by reducing both fabrication complexity and cost of these intricate optical devices, while increasing customizability.

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Section: Resultsmentioning

confidence: 96%

Section: ■ Results and Discussionmentioning

confidence: 99%

Grayscale-to-Color: Scalable Fabrication of Custom Multispectral Filter Arrays

Williams¹,

Gordon²,

Gruber³

et al. 2019

ACS Photonics

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“…High-energy (EBL) offers a range of advantages over low-energy systems, including proximity effect reduction, vertical resist sidewalls and dimension accuracy over rough surfaces [7,8]. Nanofabrication on insulating substrates using high energy EBL can be challenging due to several key factors.…”

Section: Introductionmentioning

confidence: 99%

“…Nanofabrication on insulating substrates using high energy EBL can be challenging due to several key factors. These include increased electron back scattering; insufficient charge dissipation; large area dose required for exposing conventional high resolution e-beam resists (such as poly(methyl methacrylate) (PMMA) / hydrogen silsesquioxane (HSQ) / ZEP-series) at high EBL acceleration voltages; and inevitably a large beam current in order to pattern with acceptable throughput [7][8][9][10][11][12][13][14][15][16]. Workarounds include depositing an ultra-thin metallic layer either above or below the resist or using a conductive polymer; both methods are used to dissipate the built-up charge during exposure [10,[17][18][19][20].…”

Section: Introductionmentioning

confidence: 99%

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Fabrication of nanostructured transmissive optical devices on ITO-glass with UV1116 photoresist using high-energy electron beam lithography

Williams

Bartholomew²,

Rughoobur³

et al. 2016

Nanotechnology

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High-energy electron beam lithography for patterning nanostructures on insulating substrates can be challenging. For high resolution, conventional resists require large exposure doses and for reasonable throughput, using typical beam currents leads to charge dissipation problems. Here, we use UV1116 photoresist (Dow Chemical Company), designed for photolithographic technologies, with a relatively low area dose at a standard operating current (80 kV, 40-50 μC cm, 1 nAs) to pattern over large areas on commercially coated ITO-glass cover slips. The minimum linewidth fabricated was ∼33 nm with 80 nm spacing; for isolated structures, ∼45 nm structural width with 50 nm separation. Due to the low beam dose, and nA current, throughput is high. This work highlights the use of UV1116 photoresist as an alternative to conventional e-beam resists on insulating substrates. To evaluate suitability, we fabricate a range of transmissive optical devices, that could find application for customized wire-grid polarisers and spectral filters for imaging, which operate based on the excitation of surface plasmon polaritons in nanosized geometries, with arrays encompassing areas ∼0.25 cm.

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Radiation Exposure

Moreau¹

1988

Semiconductor Lithography

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High voltage electron beam lithography

Cited by 18 publications

References 17 publications

Grayscale-to-Color: Scalable Fabrication of Custom Multispectral Filter Arrays

Grayscale-to-Color: Scalable Fabrication of Custom Multispectral Filter Arrays

Fabrication of nanostructured transmissive optical devices on ITO-glass with UV1116 photoresist using high-energy electron beam lithography

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