High-throughput characterization of mechanical properties of Ti–Ni–Cu shape memory thin films at elevated temperature

Zarnetta, Robert; Kneip, S.; Somsen, Christoph; Ludwig, Alfred

doi:10.1016/j.msea.2011.05.006

Cited by 21 publications

(15 citation statements)

References 61 publications

(76 reference statements)

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“…Zarnetta et al [23] reported an average elastic modulus of approximately 115 GPa for a Ti 48 Ni 48 Cu 10 film, ~600 nm thick, annealed in vacuum for 1 h at 500°C. In this study a lower average value (~95 GPa) was determined for the NiTiCu12 film.…”

Section: Mechanical Properties and Microstructurementioning

confidence: 99%

“…Zarnetta et al [23] investigated the mechanical properties of austenitic and martensitic Ni-TiCu thin films through nanoindentation. Even in this case, off-stoichiometric compositions with a constant Cu content exhibited, both at ambient and high temperatures (~80°C), higher hardness and Young's modulus resulting from precipitation hardening.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Effects of Cu on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films

Callisti

Tichelaar

Mellor

et al. 2013

Surface and Coatings Technology

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The microstructure of sputter deposited Ti-rich Ni-Ti thin films doped with Cu in the range 0-20.4 at.% and annealed for 1 h at 500 and 600°C has been investigated and correlated with the mechanical properties of the films measured by depth-sensing nanoindentation. X-ray diffraction analysis showed the microstructural evolution of Ni-Ti thin films when doped with Cu and annealed at different temperatures. Heat treatments promoted the nucleation and growth of Ti 2 Ni precipitates in Ti-rich Ni-Ti thin films, which affected the stability of austenitic and martensitic phases at ambient temperature. Doping with Cu caused the formation of Ti(Ni, Cu) 2 plate precipitates, which became more finely and densely dispersed in the grains with increasing Cu content. TEM analysis showed a columnar grain morphology extended through the whole films thickness, while with increasing Cu content a noticeable lateral grain refinement was induced by segregation of a (Ni, Cu)-rich phase to grain boundaries. The nano-hardness increased almost linearly with increasing Cu content owing to this grain refinement, though differences between samples annealed at different temperatures were found which could be related to the evolution of Ti(Ni, Cu) 2 plate precipitates with annealing temperature and Cu content. The Young's modulus exhibited a similar dependence on Cu content as nano-hardness, though no significant differences were observed with increasing annealing temperatures.

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Section: Mechanical Properties and Microstructurementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effects of Cu on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films

Callisti

Tichelaar

Mellor

et al. 2013

Surface and Coatings Technology

View full text Add to dashboard Cite

show abstract

“…Young's modulus and hardness of the selected compositions were evaluated using high-throughput nanoindentation [15,16]. The nanoindenter (XP, MTS) with a Berkovich tip was used to collect data using continuous stiffness measurements (CSM) up to a maximum indentation displacement of 50 nm.…”

Section: Methodsmentioning

confidence: 99%

Composition–Structure–Property Relations in Au35–68Cu49–15Al16–17 Shape Memory Thin Films

Buenconsejo

Pfetzing‐Micklich

Paulus

et al. 2016

Shap. Mem. Superelasticity

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The phase transformation behaviour, structure and mechanical properties of Au 35-68 Cu 49-15 Al 16-17 thin film shape memory alloys (SMA) have been investigated, with emphasis on the effects of Au content. The results revealed the underlying composition-structure-property relations. The thermal transformation hysteresis (DT) is wide (*55 K) for thin films with Au \50 at.%, while it is narrow (*15 K) for thin films with Au [50 at.%. This behaviour is correlated with the change in lattice constant of b-(Au-Cu-Al) (a b), suggesting a structural origin on the DT behaviour. The mechanical properties, such as hardness and elastic modulus, varied in the range of 2-4 and 70-120 GPa, respectively. The optimum Au composition range for tuning the functional property is between 43 and 55 at.% Au, where the least amount of non-transforming phases form and DT can be tailored between 55 K (43 at.% Au) and 17 K (55 at.% Au). This is important for the development and practical application of Au-Cu-Al based thin film SMA.

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“…Consequently the instrument measures a combination of the indenter penetrating the sample and the dimensional change of the indenter thus compromising the experiment. The deficiencies of the sample-only heating approach were recently highlighted by Everitt et al on fused silica and gold [119], Tang and Zhang on Si [120], and Zarnetta et al on a TiNiCu shape memory alloy [121]. These studies reported elevated temperature indentation curves dominated by thermal drift when sample-only heating was used.…”

Section: Measuring High Temperature Mechanical Properties By Nanoindementioning

confidence: 99%

Advanced Nanomechanical Test Techniques

Beake¹,

Harris²,

Liskiewicz³

2015

Materials Characterization

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High-throughput characterization of mechanical properties of Ti–Ni–Cu shape memory thin films at elevated temperature

Cited by 21 publications

References 61 publications

Effects of Cu on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films

Effects of Cu on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films

Composition–Structure–Property Relations in Au35–68Cu49–15Al16–17 Shape Memory Thin Films

Advanced Nanomechanical Test Techniques

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