High temperature reliability on automotive power modules verified by power cycling tests up to 150°C

Coquery, G.; Lefranc, G.; Licht, Thomas; Lallemand, Richard; Seliger, N.; Berg, Hermann

doi:10.1016/s0026-2714(03)00318-4

Cited by 31 publications

(27 citation statements)

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“…Several papers have also been published on the topic of power modules accelerated ageing tests (thermal cycling and power cycling) in order to estimate the level of semiconductors expectancy lifetime [17]- [18] and to study the failure mechanisms and effects [18]- [20]- [21]. It has been reported that repetitive failures have two different sources: an external one which can be, for example, linked to faulty control signal [22] and an internal one, linked to physical degradation of the power semiconductor.…”

Section: Iipower Electronic Architecture Tolerant To Semiconductor Fmentioning

confidence: 99%

“…It has been reported that repetitive failures have two different sources: an external one which can be, for example, linked to faulty control signal [22] and an internal one, linked to physical degradation of the power semiconductor. Examples of these internal failures are: bond wire lift off, gate leakage failure and damages on semiconductors chip and solder [18], SiAl contact ageing [21], electro-migration effect [20], latch-up [23]. These internal failures can modify the operating state of the semiconductor and induce abnormal behavior like OC or SC states.…”

Section: Iipower Electronic Architecture Tolerant To Semiconductor Fmentioning

confidence: 99%

“…They are subject to electro-thermal and also mechanical stresses, accelerating their failure mechanisms [17]. These failures are mainly induced by power and thermal cycling of the semiconductor device [18]. For example, an interesting investigation conducted on a Renault Kangoo electric vehicle has been carried out in [19].…”

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confidence: 99%

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Space-Vector PWM Control Synthesis for an H-Bridge Drive in Electric Vehicles

Kolli¹,

Béthoux

Bernardinis³

et al. 2013

IEEE Trans. Veh. Technol.

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Abstract-This paper deals with a synthesis of Space Vector PWM control methods applied for a H-bridge inverter feeding a 3-phase Permanent Magnet Synchronous Machine in Electric Vehicle application. First, a short survey of existing power converter architectures, especially those adapted to degraded operating modes, is presented. Standard SVPWM control methods are compared with three innovative ones using EV-drive specifications in the normal operating mode. Then, a rigorous analysis of the margins left in the control strategy is presented for a semiconductor switch failure to fulfill degraded operating modes. Finally, both classic and innovative strategies are implemented in numerical simulation; their results are analyzed and discussed. Index Terms-Motor drives, Inverters, Space vector pulse width modulation (SVPWM), Permanent magnet machines, Semiconductor device reliability I.INTRODUCTIONPower converters are increasingly used in automotive applications for many reasons such as power conditioning, power management, and consumption reduction. As for any embedded transportation system, these power converters are subject to severe constraints especially regarding compactness and vehicle integration. More specifically electric vehicles (EVs) require a high degree of availability (continuity of service). In particular the constraining automotive environment is characterized by severe traction-braking cycles which induce power and thermal cycling during running phases of the vehicle [1]- [2]. Indeed, thermo-mechanical stresses have a significant impact on the lifetime power switches [3]. Consequently, there is a degradation of the semiconductor devices, which finally forces them into a failed state: short-circuit (SC) or open-circuit (OC) [2]. Such failures occurring on single power switches can affect the function of power converters and spread through the traction chain elements. It is then necessary to first isolate the fault, confine it and lastly reconfigure the control algorithms to operate in the presence of the fault. Obviously, the topology of the power converters or the power chain must be adapted to allow operation in degraded mode:-by associating a fourth additional half bridge in a three-phase inverter topology connected to the neutral point of the electric motor [4]. IFSTTAR/COSYS/LTN-Laboratoire des Technologies Nouvelles 2 LGEP-Laboratoire de Génie Electrique de Paris-by using multilevel inverters topologies used in a high power traction drive [5].-by redistributing the control efforts in a four-wheel independently driven electric vehicles [6]… Furthermore, faults may also happen on sensors and can be taken into account by active fault-tolerant control systems. For example in [7]-[8], authors consider a high-performance induction-motor drive for an EV or a hybrid one (HEV). The proposed systems detect a sensor loss or a sensor recovery and dynamically change its strategies to sustain the best control performances.Besides, faults may also occur in the electrical machine and can be considered using fa...

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Section: Iipower Electronic Architecture Tolerant To Semiconductor Fmentioning

confidence: 99%

Section: Iipower Electronic Architecture Tolerant To Semiconductor Fmentioning

confidence: 99%

See 1 more Smart Citation

Space-Vector PWM Control Synthesis for an H-Bridge Drive in Electric Vehicles

Kolli¹,

Béthoux

Bernardinis³

et al. 2013

IEEE Trans. Veh. Technol.

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“…Le diamètre des fils de bonding est généralement de 300 µm dans les modules de moyenne puissance. Une étude récente sur la fatigue thermo-mécanique de modules de puissance dédiés aux applications de traction automobile (véhicule hybride et alterno démarreur) a montré que la levée des fils de bonding pouvait être la principale cause de défaillance [7] lors d'un fonctionnement à haute température (la température de la puce varie entre 85°C et 150°C dans le cas présent, et celle du boîtier entre 50°C et 115°C).…”

Section: Bunclassified

“…Ces deux réseaux nécessitent des dispositifs électroniques de puissance qui satisfassent à la fois des contraintes de coût et un besoin en terme de durée de vie de l'ordre de 8000h de fonctionnement, (ce qui correspond à environ 200.000km) dans un environnement thermique nominal de 90°C pouvant monter jusqu'à 120°C et de l'ordre de 400 kcycles de puissance [7].…”

Section: Applications Automobilesunclassified

Composants à semi-conducteur de puissance pour des applications à haute température de fonctionnement

Allard¹,

Coquery²,

Dupont³

et al. 2005

J3eA

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Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review

Lim

Lee

2021

J Mech Sci Technol

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As the cooling capacity of the active cooling devices has reached their allowable heat flux limit, heat spreading technologies are becoming more remarkable in the thermal management of high-power electronics. Flat plate two-phase heat spreaders (FTHSs) are advantageous for the thermal management of electronic devices due to their simplicity, powerfree operation, and high reliability. This review is based on understanding the working mechanism and limitations of FTHSs. As the power density of electronic devices increases, researchers focus on performance improvement to overcome their malfunctioned working conditions. This review summarizes the major parameters of FTHS that affect heat transfer performance. Moreover, recent advances in FTHSs suggest that new design concepts can extend the maximum operating heat flux of thermal management devices. This review can establish a direction for studying higher-performance heat spreaders and identifying the latest trends.

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High temperature reliability on automotive power modules verified by power cycling tests up to 150°C

Cited by 31 publications

References 0 publications

Space-Vector PWM Control Synthesis for an H-Bridge Drive in Electric Vehicles

Space-Vector PWM Control Synthesis for an H-Bridge Drive in Electric Vehicles

Composants à semi-conducteur de puissance pour des applications à haute température de fonctionnement

Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review

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