“…Although the differences in thermal expansion coefficient are not large -3.77 × 10 −6 K −1 for Si (α Si , average value for 300-900 K [14,15]) and 4.15 × 10 −6 K −1 for AlN (α AlN , 293-1073 K [16]), an increase in tensile stress for AlN on Si must occur during the cooling-down process. Additional threading dislocations may be generated at island-island junctions, as shown in the inserted image in Fig.…”