2013
DOI: 10.1016/j.surfcoat.2013.06.011
|View full text |Cite
|
Sign up to set email alerts
|

High temperature chemical vapor deposition of aluminum nitride, growth and evaluation

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
27
0

Year Published

2013
2013
2023
2023

Publication Types

Select...
8
1

Relationship

1
8

Authors

Journals

citations
Cited by 25 publications
(27 citation statements)
references
References 48 publications
0
27
0
Order By: Relevance
“…We have already shown that the growth of thin AlN layers (<500 nm) leads to tensile stress at room temperature [17]. We discuss in this the NbN layer with ǫ epi =-11%.…”
Section: Role Of Aln Layer On Residual Stress In Nbn Layersmentioning
confidence: 86%
“…We have already shown that the growth of thin AlN layers (<500 nm) leads to tensile stress at room temperature [17]. We discuss in this the NbN layer with ǫ epi =-11%.…”
Section: Role Of Aln Layer On Residual Stress In Nbn Layersmentioning
confidence: 86%
“…This indicates that the c lattice parameter is much affected by the annealing temperature which can be explained by the presence of the strain in the crystal. This strain is the sum of the extrinsic stress due to the thermal expansion mismatch between the crystal and substrate, and the intrinsic stresses developed during the growth of the film [9]. In order to establish a correlation between the structural properties and SAW device performances, the variation of the net peak area of the (002) plan and the relative insertion loss (IL curve was reported in previous works [4]) with the variation of the annealing temperature is shown in figure 4.…”
Section: Resultsmentioning
confidence: 99%
“…This is because AlN exhibits the desired combination of characteristics such as high thermal conductivity (320 W/mK), good corrosion resistance, high hardness, high electrical resistivity and high wear resistance . In this regards various methods have been developed for the formation of aluminum nitride including physical vapor deposition (PVD), chemical vapor deposition (CVD), glow discharge,, magnetron sputtering,, active screen plasma treatment and ion‐implantation…”
Section: Introductionmentioning
confidence: 99%