Material properties and performance of metamorphic optoelectronic integrated circuits grown by molecular beam epitaxy on GaAs substratesA technique for the heteroepitaxy of GaAs/Si films having reduced threading dislocation density is presented. The important attribute of this technique is the suppression of three-dimensional Volmer-Weber island formation during initial deposition. This suppression is achieved by deposition of a stoichiometric GaAs buffer layer by a migration-enhanced epitaxy technique on silicon at 348 K to a thickness greater than the ''monolithic thickness,'' h m . Subsequent GaAs films deposited by conventional molecular beam epitaxy on buffer layers of thickness greater than h m possess structural and optical characteristics that exceed those for state-of-the-art GaAs/Si layers: an x-ray full width at half maximum ͑FWHM͒ of 110 arcsec with a dislocation density at the film surface of 3ϫ10 6 cm Ϫ2 and a concomitant 4 K photoluminescence FWHM of 2.1 meV. The p-i-n structures suitable for use as light-emitting diodes ͑LEDs͒ that were grown on the reduced threading dislocation density GaAs/Si and by means of forward-and reverse-bias measurements, demonstrated an ideality factor of nϭ1.5, an increased reverse-bias breakdown electric field of 2.1ϫ10 7 V/m, and an intrinsic region resistivity of 4ϫ10 7 ⍀ cm for LEDs of increasingly smaller mesa size.