2002
DOI: 10.1109/16.998590
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High-quality polycrystalline Si TFTs fabricated on stainless-steel foils by using sputtered Si films

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Cited by 48 publications
(38 citation statements)
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“…[5][6][7] The key processes in fabricating LTPS TFTs are the crystallization methods that convert a-Si into polycrystalline Si and ion doping for the formation of source/drain ohmic contact. The crystallization of an a-Si film is performed using an excimer laser with wave length of 308 nm.…”
Section: Introductionmentioning
confidence: 99%
“…[5][6][7] The key processes in fabricating LTPS TFTs are the crystallization methods that convert a-Si into polycrystalline Si and ion doping for the formation of source/drain ohmic contact. The crystallization of an a-Si film is performed using an excimer laser with wave length of 308 nm.…”
Section: Introductionmentioning
confidence: 99%
“…This phenomenon has not previously been observed for PMOS devices on bulk. In case of polysilicon material, existence of grain boundaries, which are potentially weak mechanical points, raise the possibility of formation of micro cracks along with the direction of grain boundaries at large level of tensile strain [16]. Creation of micro cracks changes the distribution of longitudinal stress throughout the TFT channel and may cause the mobility of both type devices to saturate.…”
Section: Resultsmentioning
confidence: 99%
“…As the key device used in flat panel displays, lowtemperature poly-Si (LTPS) thin-film transistors (TFTs) gain much research interest for building peripheral circuits on glass substrates to realize system-on-panel [1][2]. To assure circuit's long lifetime, much investigation on LTPS TFT's reliability has been done.…”
Section: Introductionmentioning
confidence: 99%