“…Investigators have successfully implemented stepgraded mixed group-III alloy buffers composed of (InGa)As or (InAl)As, but both of these approaches suffer from very rough morphologies and large residual strains [5,7]. In(PAs) buffers possess both a lower roughness for a similar amount of latticemismatch strain relief and a lower residual strain for a similar buffer thickness [8]. These improved physical characteristics are believed to be related to the superior performance of (InGa)As TPV cells fabricated using In(PAs) buffers [6,9].…”