High power LED assemblies for solid state lighting – Thermal analysis

Kudsieh, Nicolas; Bhutta, M. Khizar; Raja, M. Yasin Akhtar

doi:10.1016/j.ijleo.2015.07.054

Cited by 10 publications

(7 citation statements)

References 11 publications

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Section: Literature Reviewmentioning

confidence: 98%

“…For example, Kudsieh used ANSYS-13TMFFM to investigate chip-on-plate LEDs for solid state lighting and backlight displays. The results showed that a rectangular substrate has an effective thermal diffusion and uniform temperature distribution as compared to the circular and irregular substrates [6].Sealed in a close and compact housing, the PCBAs of the modern electronic devices often suffer from overheating problems. In the housing, high heat conduction efficiency is necessary for producing a uniform temperature distribution over the PCBA.…”

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confidence: 99%

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Study on Thermoelectric Conversion and Conjugate Heat Transfer for PCBA by Finite Element Analysis

Lin

Cheng

Zheng

et al. 2019

2019 IEEE International Conference on Computation, Communication and Engineering (ICCCE)

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In this study, the optical sphere and the power analyzer were exploited to measure the optical and power parameters for the high-power LED lamps. The results, derived from the experimental data, were used as the power distribution inputs in the finite element analysis (FEA) for the determination of the temperature distribution for the printed circuit board assembly (PCBA) built in the LED lamp. In the finite element analysis, the conjugate heat transfer model was adapted for the calculation of the heat transfer, including thermal conductivity, convection and radiation. Applied on the power chips located on the PCBA, the graphene thermal interface material (TIMs) had been studied for its effects on the temperature distribution. For an accurate simulation about the LED lamp, the model with closed and compact space was built in the analysis. Compared to the experimental data, it showed that the simulation results had a deviation in the range of 3-5% around the main heating source, the light-emitting diodes. It proves the FEA model proposed in this study were well developed for the simulation of the temperature distribution for the high-power LED lamps which have mixed heat transfer mechanisms. The thermal radiation effects by TIMs with graphene were also investigated in this study and proven to be useful for the heat dissipation for the LED lamps. power input is high and the volume of the VR device is small, cooling the power chips will be very difficult. Obviously, the traditional TIMs or grease is not enough for the cooling requirements for the up-to-date electronic devices. There should be new heat sinkers or dissipators which are able to solve the over-heat problems for the powerful and compact electronic devices.In this study, the conjugate heat transfer model provided by the commercial finite volume method (FVM) software, FLUENT, will be used for the analysis about the temperature distribution for the electronic devices with high-power chips and compact volumes, such as LEDs and VRs. The values of power for the dominant chips on the PCBA will be derived experimentally by the optical sphere and the power analyzer. In the FEA model, the power chips will be simulated as heat sources. Heat by conduction will pass through the printed circuit board from the power chips. On the boundary between the PCBA and air, heat transfer by convection will happen. In addition, when the power chips are applied with TIMs of graphene, the heat transfer by radiation will be introduced in the analytic model. Finite space will be constructed to simulate the cases for LED lights. The results of simulation will be verified by those data obtained by the experiments, which confirms the validity of the proposed FEA model. Literature ReviewThe parameters for the design of LED lights include luminous flux, chip temperature, input power and cooling mechanism, etc. An excessively high operating temperature will decrease the performance of LEDs. Generally, the higher the luminous flux is, the higher the operational temperature is. Precise measu...

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Section: Literature Reviewmentioning

confidence: 98%

mentioning

confidence: 99%

Study on Thermoelectric Conversion and Conjugate Heat Transfer for PCBA by Finite Element Analysis

Lin

Cheng

Zheng

et al. 2019

2019 IEEE International Conference on Computation, Communication and Engineering (ICCCE)

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“…As LED chips require an electronic device or a driver to operate it, we can pair the chip with different device or driver to alter the current supplied and the junction temperature to obtain a different efficacy, lumen output, and life according to the requirement. Conventional lamps generally run at high temperatures and LEDs are considered to run cooler than they do, but the junction temperature can be quite high for some designs [1], [25]. SSL devices face the issue of thermal stability.…”

Section: ) Temperaturementioning

confidence: 99%

“…Increase in the chip temperature leads to drop in efficiency as the impurities get excited and occupy the holes reducing the number of radiative electron-hole recombination. A red shift occurs in the output spectrum due to higher temperatures because the band gap of the material shrinks [25], [26]. An array type LED assembly requires thermal uniformity and similar light output from all the chips incorporated.…”

Section: ) Temperaturementioning

confidence: 99%

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Solid State Lighting: A Summarization of Advancements

Balaji¹,

Srivastava²,

Bagchi³

et al. 2019

Int. J. Adv. Sci. Eng. Inf. Technol.

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Solid State Lighting is a rapidly growing new technology in the field of lighting. By utilizing the concepts of solid-state physics and electronics, it generates light. Light emitting diodes and organic light emitting diodes pose several advantages over the current lighting technology but they still require development and research for using them to their full potential. In this paper the characteristics, sources of uncertainty, and market status of light emitting diode are reviewed to provide more suitable research directions for advancement in the field of solid-state lighting. Challenges faced by Light emitting diodes for maintaining color and visual comfort are also illustrated. Failure modes and environmental impact of light emitting diodes are also analysed. Quantum dot based solid state lightening is also presented to study the chromatic characteristics. Some critical factors of concern for broader application of light emitting diodes and additional enhancements in electrical, optical, temperature characteristic, high power output and color furnishing capabilities are also demonstrated in paper. Light emitting diodes wattage output and efficiency are also discussed for practical viability of solid state devices in emerging fields. The extension lead of current LED technology in evolving applications are considered as accumulation of numerous technologies such as wireless, communication, sensors and control engineering. Undoubtedly, LED engineering is contemporary and the price maybe unreasonable. Nevertheless, it will find its usage in very nearly all applications and the initiation of new techniques that might lessen the cost.

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Analysis of junction temperatures for groups III–V semiconductor materials of light-emitting diodes

Chen

et al. 2017

Opt Quant Electron

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High power LED assemblies for solid state lighting – Thermal analysis

Cited by 10 publications

References 11 publications

Study on Thermoelectric Conversion and Conjugate Heat Transfer for PCBA by Finite Element Analysis

Study on Thermoelectric Conversion and Conjugate Heat Transfer for PCBA by Finite Element Analysis

Solid State Lighting: A Summarization of Advancements

Analysis of junction temperatures for groups III–V semiconductor materials of light-emitting diodes

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