High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology

Hou, Fengze; Guo, Xuguang; Wang, Qidong; Wang, Wenbo; Lin, Tingyu; Cao, Liqiang; Zhang, G. Q.; Ferreira, J.A.

doi:10.1109/ectc.2018.00208

Cited by 11 publications

(10 citation statements)

References 10 publications

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“…Similarly, in Fig. 20, the gate driver and a low-temperature co-fired ceramic (LTCC) inductor are packaged together in a PCB system [91].…”

Section: A System Integrationmentioning

confidence: 99%

“…The structural complexity of the mixed area of vias and the embedding materials creates challenges for analysis, such as modeling the thermal conductivity and electrical conductivity of those areas. [91] reported an equivalent thermal conductivity model of the vias. For high power PCBs, thicker copper layers up to 1 mm are required.…”

Section: B Pcb Embedded Technologymentioning

confidence: 99%

“…Besides, proper thermal-mechanical and dielectric performance are necessary. A study from the Delft University of Technology proposed that bismaleimide-triazine (BT) for embedding materials is a good selection for embedding material [91], [102]. BT is characterized to have a high Tg as 260℃ and a matched CTE of 5.3×10 -6 /℃.…”

Section: B Pcb Embedded Technologymentioning

confidence: 99%

“…The embedding material in PCB embedded packaging is faced with similar challenges to the encapsulant materials. Compared with common FR-4, the BT material has a low CTE of 5.3×10 -6 /°C, a higher thermal conductivity of 0.8 W/m-K, and a high Tg up to 260 ℃ [91]. The LTCC also receives extensive attention due to its matched CTE.…”

Section: E Advanced Materialsmentioning

confidence: 99%

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Automotive Power Module Packaging: Current Status and Future Trends

et al. 2020

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Semiconductor power modules are core components of power electronics in electrified vehicles. Packaging technology often has a critical impact on module performance and reliability. This paper presents a comprehensive review of the automotive power module packaging technologies. The first part of this paper discusses the driving factors of packaging technology development. In the second section, the design considerations and a primary design process of module packaging are summarized. Besides, major packaging components, such as semiconductor dies, substrates, and die bonding, are introduced based on the conventional packaging structure. Next, technical details and innovative features of state-of-the-art automotive power modules from major suppliers and original equipment manufacturers are reviewed. Most of these modules have been applied in commercial vehicles. In the fourth part, the system integration concept, printed circuit board embedded packaging, three-dimensional packaging, press pack packaging, and advanced materials are categorized as promising trends for automotive applications. The advantages and drawbacks of these trends are discussed, and it is concluded that a preferable overall performance could be achieved by combining multiple technologies. INDEX TERMS Electric vehicles, power electronics, semiconductor device packaging TABLE I PRIMARY DESIGN CONSIDERATIONS OF MODULE PACKAGING Design considerations Details Size Volume, weight, power density, energy density. Electrical performance Current rating, voltage rating, switching frequency range, power loss, electrical insulation, electromagnetic interference (EMI). Thermal management Temperature distribution, thermal resistance (Rth), heat capacity, coefficient of thermal expansion (CTE). Mechanical strength Thermal stress distribution, material properties (Tensile strength, flexural strength, peel strength, etc.), external shock and vibration. Reliability and fatigue Joints failure, crack propagation, delamination, lifetime under temperature and power cycling. Manufacturability and assembly Manufacture procedure, process temperature and pressure, external connections.

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“…Similarly, in Fig. 20, the gate driver and a low-temperature co-fired ceramic (LTCC) inductor are packaged together in a PCB system [91].…”

Section: A System Integrationmentioning

confidence: 99%

Section: B Pcb Embedded Technologymentioning

confidence: 99%

Section: B Pcb Embedded Technologymentioning

confidence: 99%

Section: E Advanced Materialsmentioning

confidence: 99%

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Automotive Power Module Packaging: Current Status and Future Trends

et al. 2020

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“…2) Power Chip-on-Inductor Package: In [45], a power chip-on-inductor (PCoI) packaging technique with doublesided cooling was presented. The structure diagram of PCoI package is shown in Fig.…”

Section: -D Interconnect Schemementioning

confidence: 99%

Review of Packaging Schemes for Power Module

Hou

Wang²,

Cao

et al. 2020

IEEE J. Emerg. Sel. Topics Power Electron.

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SiC devices are promising for outperforming Si counterparts in high-frequency applications due to its superior material properties. Conventional wirebonded packaging scheme has been one of the most preferred package structures for power modules. However, the technique limits the performance of a SiC power module due to parasitic inductance and heat dissipation issues that are inherent with aluminum wires. In this article, low parasitic inductance and high-efficient cooling interconnection techniques for Si power modules, which are the foundation of packaging methods of SiC ones, are reviewed first. Then, attempts on developing packaging techniques for SiC power modules are thoroughly overviewed. Finally, scientific challenges in the packaging of SiC power module are summarized.

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High power density inverter utilizing SiC MOSFET and interstitial via hole PCB for motor drive system

Sato

Tanaka

Hori

et al. 2021

Electrical Engineering Japan

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This paper proposes a high power density inverter utilizing SiC metal‐oxide‐semiconductor field‐effect transistor (MOSFET) modules and an interstitial via hole (IVH) printed circuit board (PCB) for a motor drive system. The inverter also includes a power circuit, heatsink, cooling fan, gate drive circuit, and DC capacitors. The output power density of the proposed inverter is 81 kW/L. The inverter outputs 37 kW for motor drive applications. To achieve this superior output power density, this paper explains a prototype SiC MOSFET module without an antiparallel schottky barrier diode, and a unique multilayer laminate IVH PCB to connect the modules and DC capacitors. This paper describes the experimental results to verify the motor drive performance and the increase in temperature under the rated load operation.

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High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology

Cited by 11 publications

References 10 publications

Automotive Power Module Packaging: Current Status and Future Trends

Automotive Power Module Packaging: Current Status and Future Trends

Review of Packaging Schemes for Power Module

High power density inverter utilizing SiC MOSFET and interstitial via hole PCB for motor drive system

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