High Performance Silicone Gel as IC Device Chip Protection

Wong, Ching‐Ping

doi:10.1557/proc-108-175

Cited by 25 publications

(1 citation statement)

References 11 publications

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“…Thus, silicone resins are widely used in electronic packaging. For example, silicone resins have been utilized for IC packaging [1], [2] and silver filled silicone-based as conductive adhesives [3], [4]. Tessera's BGA TM chip scale package uses a silicone elastomer as stress-relief buffer layer in the flexible circuit.…”

Section: Introductionmentioning

confidence: 99%

Separation of low molecular siloxanes for electronic application by liquid-liquid extraction

Urasaki

Wong

1999

IEEE Trans. Electron. Packag. Manufact.

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Silicone resins are widely used for electronic packaging as potting and encapsulating materials. Silicone resins have many advantages for electronic packaging applications such as superior electrical properties, thermal stability, low water absorption, etc. Furthermore, silicone resins are not only used as protective materials for integrated circuit (IC) devices but also as conducting materials for interconnection. However, silicone resins have two big drawbacks: low adhesion strength and low molecular weight creep. A simple liquid-liquid extraction method has been developed to purify silicone resins, which will improve adhesion strength and eliminate low molecular weight creep. This paper describes the results of the liquid-liquid extraction method to remove low molecular weight cyclic siloxanes. Fourier transform-infrared (FT-IR) spectroscopy was used to monitor the removal rate of low molecular weight cyclic siloxanes. Thermogravimetric analysis (TGA) was used to evaluate the purity of silicone resin. Gas chromatography-mass spectrometry (GC/MS) was used to identify the low molecular weight cyclic siloxanes. Thermomechanical analyzer (TMA), dynamic mechanical analyzer (DMA), and die shear test were used for evaluate the properties of silicone resin.

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Section: Introductionmentioning

confidence: 99%

Separation of low molecular siloxanes for electronic application by liquid-liquid extraction

Urasaki

Wong

1999

IEEE Trans. Electron. Packag. Manufact.

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Wong¹,

D'Ambra²

2000

Kirk-Othmer Encyclopedia of Chemical Technology

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Advances in electronic technology have had great technological and economic impact on the electronic industry throughout the world. The rapid growth of the number of components per chip, the rapid decrease of device dimension, and the steady increase in IC chip size have imposed stringent requirements not only on IC physical design and fabrication, but also in electronic packaging and embedding. Electronic embedding is one of the most common processes used to encapsulate and protect electronic components. With advances in VLSI technology and multichip modules packaging, embedding of high density packages in electronics has become a challenge. Various polymeric encapsulants are used for embedding these types of electronic components. These materials, such as silicones, silicon‐carbon thermosets, epoxies, polyurethanes, polyesters, polysulfides, and advanced thermoplastics, and their electrical, mechanical, and rheological properties as well as material processes related to molding, potting, casting, and saturaton coating processes, are discussed in detail. Furthermore the studies of material curing by differential calorimetry, ftir, and microdielectrometry are described.

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Embedding

Wong¹,

Xu²

2004

Kirk-Othmer Encyclopedia of Chemical Technology

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Advances in electronic technology have had great technological and economic impact on the electronic industry throughout the world. The rapid growth of the number of components per chip, the rapid decrease of device dimension, and the steady increase in IC chip size have imposed stringent requirements not only on IC physical design and fabrication, but also in electronic packaging and embedding. Electronic embedding is one of the most common processes used to encapsulate and protect electronic components. With advances in VLSI technology and multichip modules packaging, embedding of high density packages in electronics has become a challenge. Various polymeric encapsulants are used for embedding these types of electronic components. These materials, such as silicones, silicon‐carbon thermosets, epoxies, polyurethanes, polyesters, polysulfides, and advanced thermoplastics, and their electrical, mechanical, and rheological properties as well as material processes related to molding, potting, casting, and saturation coating processes, are discussed in detail. Furthermore the studies of material curing by differential calorimetry, ftir, and microdielectrometry are described. The development of a novel aluminum‐filled high dielectric composite is detached. Aluminum is a fast self‐passivation and low‐cost metal. The thin passivation layer forms a boundary layer outside of metallic spheres that has dramatic effects on the electrical, mechanical, and chemical behaviors of the resulting composites.

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High Performance Silicone Gel as IC Device Chip Protection

Cited by 25 publications

References 11 publications

Separation of low molecular siloxanes for electronic application by liquid-liquid extraction

Separation of low molecular siloxanes for electronic application by liquid-liquid extraction

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