Embedding

Abstract

Advances in electronic technology have had great technological and economic impact on the electronic industry throughout the world. The rapid growth of the number of components per chip, the rapid decrease of device dimension, and the steady increase in IC chip size have imposed stringent requirements not only on IC physical design and fabrication, but also in electronic packaging and embedding. Electronic embedding is one of the most common processes used to encapsulate and protect electronic components. With advances in VLSI technology and multichip modules packaging, embedding of high density packages in electronics has become a challenge. Various polymeric encapsulants are used for embedding these types of electronic components. These materials, such as silicones, silicon‐carbon thermosets, epoxies, polyurethanes, polyesters, polysulfides, and advanced thermoplastics, and their electrical, mechanical, and rheological properties as well as material processes related to molding, potting, casting, and saturaton coating processes, are discussed in detail. Furthermore the studies of material curing by differential calorimetry, ftir, and microdielectrometry are described.