1989
DOI: 10.1109/55.29655
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High-performance, graded AlGaAs injector, GaAs Gunn diodes at 94 GHz

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Cited by 50 publications
(16 citation statements)
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“…These simulations were performed with the terminal impedance set to 50Ω with the sole intention of establishing the limits of transit region length capable of supporting a steady-state (non-decaying) oscillation. Generally speaking, this free-running frequency is reduced when the device is embedded in a practical resonant circuit: a full discussion of this concept can be found in 13 . The simulated oscillation frequencies reported here are therefore not expected to precisely match those measured (which are defined by oscillator design), but to be slightly higher.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…These simulations were performed with the terminal impedance set to 50Ω with the sole intention of establishing the limits of transit region length capable of supporting a steady-state (non-decaying) oscillation. Generally speaking, this free-running frequency is reduced when the device is embedded in a practical resonant circuit: a full discussion of this concept can be found in 13 . The simulated oscillation frequencies reported here are therefore not expected to precisely match those measured (which are defined by oscillator design), but to be slightly higher.…”
Section: Resultsmentioning
confidence: 99%
“…The plot is taken from 13 and was produced using Monte Carlo simulations of the free running frequency of GaAs Gunn devices with and without hot-electron injection (it is noted that the power curve is based on measured values and that the simulations did not include consideration of an oscillator circuit). This shows that the free-running frequency of oscillation is reduced as the external field is increased, meaning that the oscillation frequency of the simulated time-domain response is typically expected to be higher than that measured from an oscillator circuit.…”
Section: Time-domain and Transient Response Simulationmentioning
confidence: 99%
“…1 (for more detail see Refs. [9] and [10]). Each device consists of a graded Al x Ga 1-x As barrier region, grown to have nominal thickness D ≈ 50 nm, with composition x varying from 0 to 0.3; this layer is bounded by two GaAs layers, as shown in Fig.…”
Section: Introductionmentioning
confidence: 94%
“…In heterostructural GaN Gunn diode, aluminum gallium nitride (AlGaN) barrier layer is proposed as the HEI layer that forms a slowly increased potential from emitter, i.e., cathode of Gunn diode and an abrupt drop-back potential to the transit region in order to effectively inject lots of high energy electrons into the transit region. 6 Besides it triggers the transition of high energy electrons between the central valley and the upper valley so as to form Gunn domains, this kind of HEI layer simultaneously serves as an interlayer to improve the crystal quality of transit region, in terms of the epitaxial growth of Gunn diode, which is probably an efficient and convenient method because conventional epitaxial growth approaches, such as the epitaxial-lateral-overgrowth (ELOG) and the regrowth, are cumbersome and costly through ex situ processing steps to improve the crystal quality in structures. 7,8 In addition, the aforementioned mechanism could also be applied in the high frequency GaN heterostructural devices, such as AlGaN/GaN high electron mobility transistors (HEMTs) with the dual-channel and the back-barrier structures, AlGaN/GaN heterostructure bipolar transistors (HBTs), AlGaN/GaN/AlGaN dual-barrier resonant tunneling diodes (RTDs), etc., where the AlGaN barrier layer can be used to block part of dislocations from penetrating into the GaN layer, subsequently improve the crystal quality and reduce the surface roughness of GaN active region so as to improve the performance of device.…”
Section: Introductionmentioning
confidence: 97%