“…In heterostructural GaN Gunn diode, aluminum gallium nitride (AlGaN) barrier layer is proposed as the HEI layer that forms a slowly increased potential from emitter, i.e., cathode of Gunn diode and an abrupt drop-back potential to the transit region in order to effectively inject lots of high energy electrons into the transit region. 6 Besides it triggers the transition of high energy electrons between the central valley and the upper valley so as to form Gunn domains, this kind of HEI layer simultaneously serves as an interlayer to improve the crystal quality of transit region, in terms of the epitaxial growth of Gunn diode, which is probably an efficient and convenient method because conventional epitaxial growth approaches, such as the epitaxial-lateral-overgrowth (ELOG) and the regrowth, are cumbersome and costly through ex situ processing steps to improve the crystal quality in structures. 7,8 In addition, the aforementioned mechanism could also be applied in the high frequency GaN heterostructural devices, such as AlGaN/GaN high electron mobility transistors (HEMTs) with the dual-channel and the back-barrier structures, AlGaN/GaN heterostructure bipolar transistors (HBTs), AlGaN/GaN/AlGaN dual-barrier resonant tunneling diodes (RTDs), etc., where the AlGaN barrier layer can be used to block part of dislocations from penetrating into the GaN layer, subsequently improve the crystal quality and reduce the surface roughness of GaN active region so as to improve the performance of device.…”