High performance electrically conductive epoxy/reduced graphene oxide adhesives for electronics packaging applications

Aradhana, Ruchi; Mohanty, Smita; Nayak, Sanjay K.

doi:10.1007/s10854-019-00722-5

Cited by 20 publications

(12 citation statements)

References 36 publications

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“…According to a report published by Market Research Future [2], the global epoxy resin market is estimated to accrue USD 10,620.5 million by 2023, posting a compound annual growth rate (CAGR) of 5.24% from 2017-2023. The positively growing market of epoxy resin is due to the increase of epoxy-based composite demand from automotive [3], electronics [4], building and construction industries [5]. Despite the excel properties of epoxy resin, their intrinsic properties such as fragility, brittleness, large thermal expansion, and low fire resistance has limited their end-use applications.…”

Section: Introductionmentioning

confidence: 99%

The Effect of Bi-Functionalized MMT on Morphology, Thermal Stability, Dynamic Mechanical, and Tensile Properties of Epoxy/Organoclay Nanocomposites

Chee

Jawaid

2019

Polymers

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In this work, the optimum filler loading to prepare epoxy/organoclay nanocomposites by the in-situ polymerization method was studied. Bi-functionalized montmorillonite at different filler loading (0.5, 1.0, 2.0, 4.0 wt %) was dispersed in epoxy resin by using a high shear speed homogenizer. The effect on morphology, thermal, dynamic mechanical, and tensile properties of the epoxy/organoclay nanocomposites were studied in this work. Wide-angle X-ray scattering (WAXS) and field emission scanning electron microscope (FESEM) studies revealed that possible intercalated structures were obtained in epoxy/organoclay nanocomposites. Thermogravimetric analysis (TGA) shows that epoxy/organoclay nanocomposites exhibit higher thermal stability at the maximum and final decomposition temperature, as well as higher char content, compared to pristine epoxy. The dynamic mechanical analysis (DMA) indicate that storage modulus (E′), loss modulus (E″), cross-link density and glass transition temperature (Tg) of the nanocomposites were improved with organoclay loading up to 1 wt %. Beyond this loading limit, the deterioration of properties was observed. A similar trend was also observed on tensile strength and modulus. We concluded from this study that organoclay loading up to 1 wt % is suitable for further study to fabricate hybrid nanocomposites for various applications.

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Section: Introductionmentioning

confidence: 99%

The Effect of Bi-Functionalized MMT on Morphology, Thermal Stability, Dynamic Mechanical, and Tensile Properties of Epoxy/Organoclay Nanocomposites

Chee

Jawaid

2019

Polymers

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“…The agglomeration phenomenon is a consequence of the low dispersibility of filler content. 39 A previous study on the AgMF-MWCNT hybrid ECA system showed that when the total filler loading of hybrid fillers was increased up to 15 wt.%, a much higher lap shear strength could be attained, with a maximum value of 10.56 MPa ± 1.53 MPa. 30 This observation was attributed to the beneficial characteristics of MWCNT, including the stiffness-to-weight and strength-to-weight characteristics.…”

Section: Lap Shear Strengthmentioning

confidence: 92%

Effect of Hybridization on the Functional Properties of AgMF–MWCNT-Filled Electrically Conductive Adhesive

Fadzullah

Adnan

Omar

et al. 2020

Journal of Elec Materi

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A combination of metal and non-metal filler in an epoxy resin, called a hybrid electrically conductive adhesive (ECA), is an important development in the field of highly conductive electronic interconnect materials. Carbon nanotubes (CNTs) are well known for contributing strength and stiffness to ECA and silver (Ag) has been widely used as a conductive metal. This study presents the characterization of a hybrid silver micro-flake (AgMF) with multiwalled carbon nanotubes (MWCNT) in an epoxy matrix ECA, in terms of electrical and mechanical properties. The weight percentage of AgMF used was varied, from 1 wt.% to 10 wt.%, whereas the weight percentage of MWCNT filler loading was maintained at 5 wt.%. The properties of the hybrid ECA were characterized using a four-point probe and a universal testing machine for lap shear tests. It was found that the filler hybridization lowered the performance of the ECA in terms of both electrical and mechanical properties, as compared with non-hybrid MWCNT-filled ECA. This may be attributed to the weak interaction between micro-and nano-filler particle sizes and agglomeration of the MWCNT in the epoxy matrix in the hybrid ECA system. The hybrid ECA electrical conductivity was successfully enhanced when a low ratio of AgMF and MWCNT was considered. In addition, failure analysis confirmed that the hybrid ECA with less AgMF filler loading exhibits improved adhesion strength, suggesting a superior epoxy-to-substrate bonding interface.

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“…This needs more energy for crack propagation and hence results in higher impact strength. 37 The reduction in impact strength of the nanocomposites above 0.3 vol. % may be due to the aggregated structures of the rGO.…”

Section: Characterizations Of Go and Rgomentioning

confidence: 99%

“…These aggregates act as stress concentrated points and promote fracture leading to lowering of impact strength. 37 Microstructure of epoxy/rGO nanocomposites. SEM analysis was carried out on the tensile fractured surface of neat epoxy and Ep/G nanocomposites containing 0.3 and 1.8 vol.…”

Section: Characterizations Of Go and Rgomentioning

confidence: 99%

Reduced graphene oxide / epoxy nanocomposites with enhanced dielectric, mechanical, thermomechanical and thermal properties

Maitheenkunju

Gopalakrishnan

2021

Journal of Elastomers & Plastics

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Epoxy/conducting filler nanocomposites with high dielectric performance have emanated as a promising material in electronic and electrical industry. In this work, a facile and low-cost method, that is, thermal reduction at 400°C was adopted for the preparation of reduced graphene oxide (rGO) from graphene oxide (GO). The rGO was characterized by X-ray diffraction analysis, Fourier transform infrared spectroscopy, Raman spectroscopy, Field emission scanning electron microscopy and Transmission electron microscopy. Epoxy nanocomposite presented a dielectric permittivity of 35 at 1.8 vol.% loading of rGO (Ep/G-1.8) at 103 Hz, which was 5 times higher than neat epoxy and with a low dielectric loss. With the addition of 0.3 vol.% of rGO (Ep/G-0.3), the mechanical properties such as tensile strength, Young’s modulus and impact strength were enhanced by 34%, 56% and 54%, respectively. Dynamic mechanical analysis (DMA) revealed that in comparison to epoxy, there was a tremendous enhancement of storage modulus (55%) and the glass transition temperature (Tg) exhibited a remarkable shift of 39°C towards higher temperature for Ep/G-0.3. Cross-link density and coefficient of effectiveness (C-factor) estimated from the storage modulus improved significantlyfor Ep/G-0.3. Theoretical modelling was done on the viscoelastic properties of the composites. SEM studies indicated the uniform dispersion of rGO throughout in the epoxy matrix. Thermogravimetric analysis revealed that inclusion of rGO improved the thermal stability of epoxy nanocomposites.

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High performance electrically conductive epoxy/reduced graphene oxide adhesives for electronics packaging applications

Cited by 20 publications

References 36 publications

The Effect of Bi-Functionalized MMT on Morphology, Thermal Stability, Dynamic Mechanical, and Tensile Properties of Epoxy/Organoclay Nanocomposites

The Effect of Bi-Functionalized MMT on Morphology, Thermal Stability, Dynamic Mechanical, and Tensile Properties of Epoxy/Organoclay Nanocomposites

Effect of Hybridization on the Functional Properties of AgMF–MWCNT-Filled Electrically Conductive Adhesive

Reduced graphene oxide / epoxy nanocomposites with enhanced dielectric, mechanical, thermomechanical and thermal properties

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