Characterization and Propagation of Sources and Backgrounds 1994
DOI: 10.1117/12.177936
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High-performance 512 x 512 scene projector for targets against space backgrounds

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“…The wafers contain radhard RJCMOS* underlayer electronics to enable row-column addressing with RS-232 protocol. A complete description of the design and process involved in making the igniter wafers can be found elsewhere" 11 . Figure 10 shows an optical photograph of a 4" silicon wafer containing four (4) 512 x 512 arrays, eight (8) 128 x 128 arrays, and a handful of smaller tes: structures.…”
Section: Processingmentioning
confidence: 99%
“…The wafers contain radhard RJCMOS* underlayer electronics to enable row-column addressing with RS-232 protocol. A complete description of the design and process involved in making the igniter wafers can be found elsewhere" 11 . Figure 10 shows an optical photograph of a 4" silicon wafer containing four (4) 512 x 512 arrays, eight (8) 128 x 128 arrays, and a handful of smaller tes: structures.…”
Section: Processingmentioning
confidence: 99%