“…With CMOS technology development, the reliability issues of advanced CMOS technology are becoming more challenging and complicated due to the novel material, novel process and novel device structure, e.g., Ge/GeSi channels, atom layer etching (ALE) technology, nanowires and nanosheets, etc., specially for 5 nm node and beyond [ 287 , 288 , 289 , 290 ]. Next, the transistor reliability challenge of advanced CMOS will be discussed.…”