Silicon nitride, silicon oxide, and silicon oxynitride
thin films
were deposited on the Si substrate by inductively coupled plasma chemical
vapor deposition and annealed at 1100 °C for 3 min in an Ar environment.
Silicon nitride and silicon oxide films deposited at ratios of the
reactant flow rates of SiH4/N2 = 1.875 and SiH4/N2O = 3, respectively, were Si-rich, while Si
excess for the oxynitride film (SiH4/N2/N2O = 3:2:2) was not found. Annealing resulted in a thickness
decrease and structural transformation for SiO
x
and SiN
x
films. Nanocrystalline
phases of Si as well as α- and β-Si3N4 were found in the annealed silicon nitride film. Compared to oxide
and nitride films, the oxynitride film is the least susceptible to
change during annealing. The relationship between the structure, composition,
and optical properties of the Si-based films has been revealed. It
has been shown that the calculated optical parameters (refractive
index, extinction coefficient) reflect structural peculiarities of
the as-deposited and annealed films.