2017 IEEE 67th Electronic Components and Technology Conference (ECTC) 2017
DOI: 10.1109/ectc.2017.292
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High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper-Metallized Through-Package-Vias (TPVs) in Ultra-Thin Glass Interposers

Sukhadha Viswanathan1,
Teppei Ogawa
2
,
Kaya Demir
3
et al.
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Leading-Edge and Ultra-Thin 3D Glass-Polymer 5G Modules with Seamless Antenna-to-Transceiver Signal Transmissions

Watanabe
1
,
Lin
2
,
Raj
3
et al. 2018
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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Leading-Edge and Ultra-Thin 3D Glass-Polymer 5G Modules with Seamless Antenna-to-Transceiver Signal Transmissions

Watanabe
1
,
Lin
2
,
Raj
3
et al. 2018
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
24
0
10
0
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Failure Analysis for GaAs MMIC Amplifier with Metallized Via Hole

He
1
,
Yang
2
,
Pan
3
et al. 2019
2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)
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Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications

Lin
1
,
Kanno2,
Watanabe
3
et al. 2020
Antennas Wirel. Propag. Lett.
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