Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications

Lin, Tong‐Hong; Kanno, Kimiyuki; Watanabe, Atom O.; Raj, P. Markondeya; Tummala, Rao; Swaminathan, Madhavan; Tentzeris, Manos M.

doi:10.1109/lawp.2020.3018064

Cited by 43 publications

(23 citation statements)

References 15 publications

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“…Fig. 16(a) shows a (2 × 1)-element array on 100 μm-thin laminated glass substrate, enabling broadband operation between 24.25 GHz and 40 GHz [155]. Watanabe et al presented a Yagi antenna based on a dipole at 28 GHz, see Fig.…”

Section: Antennas and Quasi-optical Structuresmentioning

confidence: 99%

RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

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Driven by the increasing demand for high-throughput communication links and high-resolution radar sensors, the development of future wireless systems pushes at ever greater operating frequencies. By analogy, high-performance computing (HPC) systems with high-bandwidth I/Os have become a mainstream solution to address multi Gbit/s data rates. Heterogeneous integration technologies play a vital role here in enhancing the performance and functional density, along with reducing the size and costs of such RF systems. In line with this trend, many passive components, which have once been monolithically integrated, are now implemented on ceramic or polymer-based packages. Besides these long-established material and process technologies, considerable efforts have also recently been devoted to the development of RF components on glass and glass-ceramics. Spurred by their low dielectric losses, extremely smooth surfaces, and excellent dimensional stability, glass technologies are emerging as a promising alternative for high-volume and high-performance RF applications. In this article, relevant glass materials and key enabling technologies are reviewed and put into context with well-established RF substrate technologies. Another focus is set on the latest glass-based packaging and interposer solutions ranging from MHz-to-THz frequencies. To showcase the development activities and practical accomplishments of the RF glass technology, also a large variety of key components is presented. Finally, the paper concludes by discussing future research and development directions of RF glass devices.INDEX TERMS MTT 70th Anniversary Special Issue, glass technology, dielectrics, packaging, interposer, system-on-package, interconnects, filters, antennas, antenna-in-package, millimeter wave (mm-wave).

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Section: Antennas and Quasi-optical Structuresmentioning

confidence: 99%

RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

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“…of integrated communication functions in a 5G antenna module as the vertical axis. The conventional and reported 5G AiP modules [4]- [6] (to the best knowledge of the authors) are to purely cover 5G mm-Wave bands without non-mm-Wave…”

Section: Trendmentioning

confidence: 99%

“…Therefore, one of the major advantages for the AiP solution [1]- [2] is to reduce the path losses between the antennas and radiofrequency integrated circuits (RFICs) owing to the shorter inbetween path lengths in the package. Also, comparatively speaking, the fabrication of the AiP solution is more mature than that of other developed mm-Wave antenna solutions [3]; thus, the AiP solution currently is the mainstream antenna solution to mobile stations and base stations [4]- [7]. For 5G, there exist two frequency segments, one for non-mm-Wave bands [8] and the other for mm-Wave bands [9].…”

Section: Introductionmentioning

confidence: 99%

“…To attain qualified data rates [9] through the 5G non-mm-Wave bands, the massive multiple-input and multiple-output (MIMO) operations are required, which means more 5G non-mm-Wave antennas should be deployed in cellular phones. In addition, to the best knowledge of the authors, based on the literature [4]- [6], [11]- [13] and the commercialized cellular phones [14]- [16], currently, the 5G (or 4G) non-mm-Wave antennas are physically separate from or assembled with the 5G mm-Wave AiP modules, implying additional design efforts and space for the non-mm-Wave antennas are needed. The reported design [17] integrated triband antennas for the wireless local area networks (WLAN) at 2.4 GHz, 5.2 GHz, and 60 GHz on the low-temperature co-fired ceramic (LTCC); however, a considerable clearance area needs to be claimed by the integrated non-mm-Wave antennas.…”

Section: Introductionmentioning

confidence: 99%

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Evolution of Innovative 5G Millimeter-Wave Antenna Designs Integrating Non-Millimeter-Wave Antenna Functions Based on Antenna-in-Package (AiP) Solution to Cellular Phones

Huang¹,

2021

IEEE Access

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This article presents an inspiring retrospect and prospect on the evolution overview of innovative 5G millimeter-Wave (mm-Wave) antenna designs integrating non-mm-Wave functions based on the antenna-in-package (AiP) solution to cellular phones. The innovative designs include mm-Wave antennas-in-package integrating non-mm-Wave antennas (AiPiA), mm-Wave antennas-in-package as nonmm-Wave antennas (AiPaA), and mm-Wave antennas-in-package integrating and as non-mm-Wave antennas (AiPiaA). In comparison with conventional AiP-based mm-Wave antenna designs, these designs advance to achieve the total solutions for the 5 th generation mobile communications (5G) antennas to cellular phones, which remarkably benefit design efforts of antenna designers for cellular phones, occupied space by antennas in cellular phones, and applications of 5G antennas to cellular phones.

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“…The antenna miniaturization techniques include shortcircuit loading, electromagnetic bandgap (EBG) and AMC [23,24,25,26,27,28,29,30]. M. Li utilizes slotted dipoles as array elements and AMC as reflectors to reduce the width and profile of the array antenna, respectively, thereby achieving size miniaturization [27].…”

Section: Introductionmentioning

confidence: 99%

Miniaturized broadband monopole antenna in 130nm CMOS with gain improvement

Huang

Sun

et al. 2022

IEICE Electron. Express

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This paper presents a miniaturized broadband monopole AOC (antenna on chip) for W-band. The AOC miniaturization is achieved by a hexagonal grid at the top layer M6 and a capacitive AMC (artificial magnetic conductor) at the bottom layer M1 based on a 130 nm CMOS process. First, the reflection phase of different modes is analyzed using electromagnetics simulation. Secondly, the axial size of the AOC with AMC is further reduced by 16.2% (compared to a straight monopole antenna with AMC) by using a hexagonal grid, and the impedance is optimized by analyzing the grid angle. The proposed miniaturized monopole antenna has the size of 367 um×194.2 um (0.1 λ 0 × 0.052 λ 0 ) at 81 GHz. Measurements show that the antenna has an impedance bandwidth of 31.5% (75-103 GHz) and a peak gain of −0.35dBi at 85 GHz. The proposed antenna has the smallest reported size and can be applied to W-band FMCW radar system on chip.

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Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications

Cited by 43 publications

References 15 publications

RF Glass Technology Is Going Mainstream: Review and Future Applications

RF Glass Technology Is Going Mainstream: Review and Future Applications

Evolution of Innovative 5G Millimeter-Wave Antenna Designs Integrating Non-Millimeter-Wave Antenna Functions Based on Antenna-in-Package (AiP) Solution to Cellular Phones

Miniaturized broadband monopole antenna in 130nm CMOS with gain improvement

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