High-frequency CMUT arrays for high-resolution medical imaging

Oralkan, Ömer; Hansen, S.T.; Bayram, B.; Yaralioglu, G.G.; Ergun, A.S.; Khuri‐Yakub, Butrus T.

doi:10.1109/ultsym.2004.1417747

Cited by 47 publications

(20 citation statements)

References 9 publications

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“…There are three major design criteria for the trench-isolated interconnects: 1) the cross-coupling capacitance between adjacent array elements should be small compared with the device capacitance; 2) the series resistance of the silicon interconnects should be insignificant relative to the device impedance; 3) the fill factor for the CMUT should be as large as possible for higher output power and broader fractional bandwidth [18]. Typically, for a 250-μm-by-250-μm CMUT element, the device capacitance is 1-2 pF.…”

Section: Designmentioning

confidence: 99%

Integration of trench-isolated through-wafer interconnects with 2d capacitive micromachined ultrasonic transducer arrays

Zhuang

Ergun

Huang³

et al. 2007

Sensors and Actuators A: Physical

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This paper presents a method to provide electrical connection to a 2D capacitive micromachined ultrasonic transducer (CMUT) array. The interconnects are processed after the CMUTs are fabricated on the front side of a silicon wafer. Connections to array elements are made from the back side of the substrate via highly conductive silicon pillars that result from a deep reactive ion etching (DRIE) process. Flip-chip bonding is used to integrate the CMUT array with an integrated circuit (IC) that comprises the front-end circuits for the transducer and provides mechanical support for the trenchisolated array elements. Design, fabrication process and characterization results are presented. The advantages when compared to other through-wafer interconnect techniques are discussed.

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Section: Designmentioning

confidence: 99%

Integration of trench-isolated through-wafer interconnects with 2d capacitive micromachined ultrasonic transducer arrays

Zhuang

Ergun

Huang³

et al. 2007

Sensors and Actuators A: Physical

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“…Piezoelectric composites have been used by Ritter et al [13], Michau et al [14], Cannata et al [17] and Brown et al [18] in their designs. A new technology that utilizes micromachined electromechanical system (MEMS) technology called cMUT (capacitive micromachined ultrasonic transducer) appears to hold great promise [15,16]. Currently the pitch in HF linear array designs is greater than 1λ and their performance is not yet upon par with commercial linear arrays at lower frequencies.…”

Section: Hf Array Imagingmentioning

confidence: 99%

High Frequency Ultrasonic Imaging

Shung

2009

Journal of Medical Ultrasound

132

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High frequency ultrasonic imaging is considered by many to be the next frontier in ultrasound. It has many clinical applications ranging from imaging the eye and skin to small animal imaging. Small animal imaging has recently generated intense interest for the purpose of evaluating the efficacy of drugs and gene therapy. Commercial high frequency scanners often termed “ultrasonic biomicroscope”, or UBM, all use mechanically scanned single element transducers at frequencies between 30 to 60 MHz with a frame rate of 30 frames/second or lower. To alleviate problems with UBMs which include mechanical motion and fixed focusing, high frequency linear arrays and imaging systems in the 20–50 MHz range have been developed. In this paper, current efforts in the development of high frequency ultrasonic imaging will be reviewed and potential biomedical applications discussed.

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“…Capacitive micromachined ultrasonic transducers (CMUTs) have inherent broad bandwidth due to their membrane structure, and they can be designed to operate in the 10-60MHz range, suitable for SL-IVUS [7,8]. Furthermore, when the lowtemperature fabrication process is used for fabrication, one may be able to integrate the electronics associated with the low channel count array and the CMUT transducers on the same silicon chip.…”

Section: Cmut Annular Arrays For Sl-ivusmentioning

confidence: 99%

2F-2 Annular CMUT Arrays for Side Looking Intravascular Ultrasound Imaging

Zahorian

Guldiken

Gurun

et al. 2007

2007 IEEE Ultrasonics Symposium Proceedings

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Although side looking intravascular ultrasound (SL-IVUS) imaging systems using single element piezoelectric transducers set the resolution standard in the assessment of the extent of coronary artery disease, improvements in transducer performance are needed to perform harmonic imaging and high resolution imaging of vulnerable plaque. With their small channel count, annular arrays exploiting the inherent broad bandwidth of CMUTs and electronic focusing capability of integrated electronics provide a path for desired SL-IVUS imaging catheters. In this paper, we first describe the design, low temperature fabrication of an 840µm diameter, 8 element CMUT annular array. Testing of the individual elements in oil shows a uniform device behavior with 100% fractional bandwidth around 20MHz without including the effects of attenuation and diffraction. We also present linear scan imaging results obtained on wire targets in oil, tissue and tissue mimicking phantoms using both unfocused and dynamically focused transducers. The results for axial and lateral resolution are in agreement predicted by the simulations and show the feasibility of this approach for high resolution SL-IVUS imaging.

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High-frequency CMUT arrays for high-resolution medical imaging

Cited by 47 publications

References 9 publications

Integration of trench-isolated through-wafer interconnects with 2d capacitive micromachined ultrasonic transducer arrays

Integration of trench-isolated through-wafer interconnects with 2d capacitive micromachined ultrasonic transducer arrays

High Frequency Ultrasonic Imaging

2F-2 Annular CMUT Arrays for Side Looking Intravascular Ultrasound Imaging

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