2007
DOI: 10.1016/j.sna.2007.04.008
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Integration of trench-isolated through-wafer interconnects with 2d capacitive micromachined ultrasonic transducer arrays

Abstract: This paper presents a method to provide electrical connection to a 2D capacitive micromachined ultrasonic transducer (CMUT) array. The interconnects are processed after the CMUTs are fabricated on the front side of a silicon wafer. Connections to array elements are made from the back side of the substrate via highly conductive silicon pillars that result from a deep reactive ion etching (DRIE) process. Flip-chip bonding is used to integrate the CMUT array with an integrated circuit (IC) that comprises the fron… Show more

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Cited by 33 publications
(14 citation statements)
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“…In 1999, they developed air-coupled nondestructive evaluation using micromachined ultrasonic transducers [9]. In 2002, Oralkan et al from Stanford University developed a linear CMUT array and a 2D CMUT array which could implement 3D ultrasonic imaging [10,11] and also conducted preliminary simulation experiments on imaging [12,13]. In 2006, Caronti et al developed a one-dimensional array of ultrasonic transducers and detectors used in medical ultrasonic imaging [14].…”
Section: Introductionmentioning
confidence: 99%
“…In 1999, they developed air-coupled nondestructive evaluation using micromachined ultrasonic transducers [9]. In 2002, Oralkan et al from Stanford University developed a linear CMUT array and a 2D CMUT array which could implement 3D ultrasonic imaging [10,11] and also conducted preliminary simulation experiments on imaging [12,13]. In 2006, Caronti et al developed a one-dimensional array of ultrasonic transducers and detectors used in medical ultrasonic imaging [14].…”
Section: Introductionmentioning
confidence: 99%
“…Through-silicon interconnects have been used with cMUT arrays to integrate the transducers with other integrated circuitry [17], [18]. PZT matrix arrays have also been fabricated on silicon multilayer interconnect circuits but required rigid substrate length of nearly 5 cm [19].…”
Section: Introductionmentioning
confidence: 99%
“…In 1994, Khuri-Yakub, research group of Stanford, E.L. Ginzton Laboratory (Stanford, CA, USA) used surface micromachined technology to produce a micro capacitive ultrasonic transducer [16], and in 1999, the same team developed air-coupled nondestructive evaluation using micromachined ultrasonic transducers [17]. In 2002, a linear CMUT array was developed by Oralkan et al from Stanford University, and then the team developed a 2D CMUT array which could implement 3D ultrasonic imaging [18][19][20][21][22][23][24][25][26][27][28], and conducted preliminary simulation experiments on imaging. In 2006, Caronti et al developed a one-dimensional array of ultrasonic transducers and detectors used in medical ultrasonic imaging [29].…”
Section: Introductionmentioning
confidence: 99%