High-cycle fatigue and strengthening in polycrystalline silicon

Boroch, Robert Edward; Müller-Fiedler, Roland; Bagdahn, J.; Gumbsch, Peter

doi:10.1016/j.scriptamat.2008.05.047

Cited by 24 publications

(6 citation statements)

References 9 publications

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“…Initially researchers have emphasized on high frequencies for prediction of the fatigue lifetime of polysilicon MEMS Journal of Quality and Reliability Engineering [88][89][90]. Not only testing the fatigue lifetime of polysilicon at lower frequencies is time consuming, but also the mechanical loading has been confined to high frequencies only [91].…”

Section: Fatigue In Memsmentioning

confidence: 99%

“…A study of the fatigue of polysilicon in the bend position [88] demonstrated, with the help of an electrostatic comb structure, beam, and movable masses, that, with the supplied voltages, the movable masses oscillated and tended to bend the beam. The fatigue fracture was calculated at the cyclic loading stress of 3 Gpa.…”

Section: Effects Of Humidity and Temperature On The Reliability Of Memsmentioning

confidence: 99%

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Reliability and Fatigue Analysis in Cantilever-Based MEMS Devices Operating in Harsh Environments

Jan

Hamid

Khir

et al. 2014

Journal of Quality and Reliability Engineering

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The microelectromechanical system (MEMS) is one of the most diversified fields of microelectronics; it is rated to be the most promising technology of modern engineering. MEMS can sense, actuate, and integrate mechanical and electromechanical components of micro-and nano sizes on a single silicon substrate using microfabrication techniques. MEMS industry is at the verge of transforming the semiconductor world into MEMS universe, apart from other hindrances; the reliability of these devices is the focal point of recent research. Commercialization is highly dependent on the reliability of these devices. MEMS requires a high level of reliability. Several technological factors, operating conditions, and environmental effects influencing the performances of MEMS devices must be completely understood. This study reviews some of the major reliability issues and failure mechanisms. Specifically, the fatigue in MEMS is a major material reliability issue resulting in structural damage, crack growth, and lifetime measurements of MEMS devices in the light of statistical distribution and fatigue implementation of Paris' law for fatigue crack accumulation under the influence of undesirable operating and environmental conditions.

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Section: Fatigue In Memsmentioning

confidence: 99%

Section: Effects Of Humidity and Temperature On The Reliability Of Memsmentioning

confidence: 99%

Reliability and Fatigue Analysis in Cantilever-Based MEMS Devices Operating in Harsh Environments

Jan

Hamid

Khir

et al. 2014

Journal of Quality and Reliability Engineering

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“…Kahn et al (2006) and Boroch et al (2008) found that the strength of poly-silicon increases when the samples have been loaded for a certain number of cycles at a stress level well below the inert strength. It can be argued that this behaviour could also be explained by a stress-enhanced growth of oxide films.…”

Section: Smooth50mentioning

confidence: 99%

“…The fatigue behaviour of MEMS materials has been investigated mainly for poly-silicon (Muhlstein et al 2002;Kahn et al 2002;Boroch et al 2008;Langfelder et al 2009). All studies have found considerable strength degradation under cyclic loading.…”

Section: Introductionmentioning

confidence: 99%

Statistical analysis and predictions of fracture and fatigue of micro-components

2011

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A number of materials typically used in MEMS technology exhibit brittle fracture behaviour which leads to a scatter in strength and a size effect as a consequence. Furthermore, some of these materials, e.g. polycrystalline silicon, show fatigue effects which limit the lifetime under cyclic loading conditions. Probabilistic methods based on the Weibull theory have been established successfully in predicting the strength of micro-components under static loading. However, the consequence of fatigue on reliability predictions has not yet been studied extensively. We present strength as well as lifetime predictions for poly-silicon components with stress concentrations based on experimental data published in the literature. Our results show that while strength predictions for components with stress concentrations based on scaling procedures works well, lifetime prediction is a challenging task associated with large prediction uncertainties. Finally, we relate the crack propagation approach used for our lifetime predictions with micro-mechanical fatigue models that are discussed for poly-silicon.

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“…Alsem et al witnessed no fatigue of unpackaged polysilicon structures in a high vacuum environment (2e-7 mBar) up to a stress level of 3.4 GPa [15]. Boroch et al demonstrated the absence of fatigue in polysilicon devices that were glass-frit sealed under low pressure at 1-2 mBar [16]. Although this is a promising result, glass-frit sealing is still susceptible to outgassing, in addition to any organic contaminants that remains because the packaging is performed at low temperatures [17].…”

mentioning

confidence: 99%

Fatigue Experiments on Single Crystal Silicon in an Oxygen-Free Environment

Hong

Yoneoka²,

Messana³

et al. 2015

J. Microelectromech. Syst.

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The fatigue lifetime of single crystal silicon (SCS) was characterized in an environment free of oxygen, humidity, and organics. Long-term (>10 10 Hz) fatigue experiments performed with smooth-walled SCS devices showed no signs of fatigue damage up to 7.5 GPa. In contrast, experiments using SCS devices with a silicon dioxide (SiO 2 ) coating and rough sidewalls due to scalloping from deep reactive ion etching exhibited fatigue drift at 2.7 GPa and suffered from short-term (< 10 10 Hz) fatigue failure at stress levels >3 GPa. In these SCS-SiO 2 experiments, the initiation of fracture occurs in the SiO 2 layer. It is concluded that fatigue in this case is likely attributed to a subcritical cracking mechanism; not reactionlayer nor dislocation related. A cross-comparison with other works from literature is developed to show that packaging a pristine device in an inert environment is necessary in order to operate devices at high-stress levels.[2013-0267]

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High-cycle fatigue and strengthening in polycrystalline silicon

Cited by 24 publications

References 9 publications

Reliability and Fatigue Analysis in Cantilever-Based MEMS Devices Operating in Harsh Environments

Reliability and Fatigue Analysis in Cantilever-Based MEMS Devices Operating in Harsh Environments

Statistical analysis and predictions of fracture and fatigue of micro-components

Fatigue Experiments on Single Crystal Silicon in an Oxygen-Free Environment

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