High aspect ratio silver grid transparent electrodes using UV embossing process

Abstract

This study presents a UV embossing process to fabricate high aspect ratio silver grid transparent electrodes on a polymer film. Transparent electrodes with a high optical transmittance (93 %) and low sheet resistance (4.6 Ω/sq) were fabricated without any high temperature or vacuum processes. The strong adhesion force between the UV resin and the silver ink enables the fabrication of silver microstructures with an aspect ratio higher than 3. The high aspect ratio results in a low sheet resistance while maintaining a high optical transmittance. Multi-layer transparent electrodes were fabricated by repeating the proposed UV process. Additionally, a large-area of 8-inch touch panel was fabricated with the proposed UV process. The proposed UV process is a relatively simple and low cost process making it suitable for large-area production as well as mass production.

Plane heating with a transparent heater film in a fish tank

“…The fabrication process of a TH is shown in Fig. 3 and includes the following steps: (1) produce of a PDMS (polydimethylsiloxane) replica from a nickel master mold, (2) transfer the patterns from a PDMS mold onto a PET substrate with UV embossing method, (3) fill in the micro trenches of the mesh pattern with silver paste by doctor blade technique, and (4) create a power bus with copper tape and coat a 4-mm-width stripe connecting the metal mesh and copper tape with silver paste [ 15 ]. The metal mesh is based on a grid design of 800-μm pitch and 10-μm linewidth.…”

“…Silver nanowire or silver nanowire composite films show good transparency and facile fabrication, but their sheet resistance is high at ∼10 Ω/□ [ [12] , [13] , [14] ]. TH can be prepared by a metal mesh with a UV embossing method, which results in good transparency, low sheet resistance, and high productivity [ 15 ].…”

High‐Resolution Patterning of Conductive Microstructures by Electrostatic Deposition of Aerosol Au Nanoparticles through the Dielectric Mask

“…[11] For this reason, researchers are developing alternative techniques to overcome these limitations. [12][13][14][15] One such technique is dry aerosol printing technology in which microstructures are formed without the use of liquid ink, and solid nanoparticles are obtained by spark ablation directly during printing. [16] Thus, the problems of ink spreading and nozzle clogging are eliminated, and subsequent thermal or laser sintering of nanoparticles allows the formation of high-aspect structures layer by layer.…”

Fabrication of mechanically reliable micrometric scale conductive pattern by direct pattern transfer using UV photopolymer penetration

“…In reflection of such demand, technology for producing a simpler conductive pattern is being developed. The fabrication of microstructural conductive electrodes by UV embossing process [12] and micrometric scale conductive pattern techniques by reel-toreel flexographic technique [13] are few examples of such emerging techniques.…”