Abstract:A mechanically reliable micrometric scale conductive wire fabrication method was developed using silver paste. In order to increase the bonding strength between silver particles, a method was developed for filling the space between particles with UV photopolymer. The UV photopolymer covers the top of a mold filled with silver paste, after which vacuum forces are generated by the evaporation of the solvent in the silver paste and the density difference between the UV photopolymer and the solvent. This results i… Show more
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