2012
DOI: 10.1016/j.tsf.2012.07.033
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Heteroepitaxy of Ir films on silicon with a ceria/yttria stabilized zirconia buffer layer

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Cited by 7 publications
(12 citation statements)
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“…In the above mentioned context, this work aims at the investigation of the effect of substrate bias on the morphology and crystallinity of iridium thin films grown at low substrate temperatures as well as the possibility to induce preferential orientation of the film in [001] direction at low substrate temperatures. In reference to the work of Tolstova et al [21], we will show that the application of a substrate bias voltage leads to an oriented growth of Ir films on A-plane sapphire (11)(12)(13)(14)(15)(16)(17)(18)(19)(20) at low temperatures. However, in contrast to their findings for the low-T heteroepitaxial growth of gold films on magnesium oxide, we applied a substrate bias only during the early stages (i.e.…”
Section: Introductionmentioning
confidence: 85%
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“…In the above mentioned context, this work aims at the investigation of the effect of substrate bias on the morphology and crystallinity of iridium thin films grown at low substrate temperatures as well as the possibility to induce preferential orientation of the film in [001] direction at low substrate temperatures. In reference to the work of Tolstova et al [21], we will show that the application of a substrate bias voltage leads to an oriented growth of Ir films on A-plane sapphire (11)(12)(13)(14)(15)(16)(17)(18)(19)(20) at low temperatures. However, in contrast to their findings for the low-T heteroepitaxial growth of gold films on magnesium oxide, we applied a substrate bias only during the early stages (i.e.…”
Section: Introductionmentioning
confidence: 85%
“…The iridium layers were deposited by rf-sputtering using a custom-build S400-S3 sputter system (FHR, Dresden, Germany) fitted with an Ir target (99,9 at.%) supplied by EVOCHEM Advanced Materials GmbH, Offenbach, Germany. The A-plane sapphire (11)(12)(13)(14)(15)(16)(17)(18)(19)(20) substrates were purchased from Situs Technicals, Wuppertal, Germany. Prior to the deposition process, the wafers were in-situ (1x10 -7 mbar) annealed at 350 °C for 60 minutes, then Argon sputtered at 2x10 -2 mbar by 350 V bias and 200 W for 8 minutes.…”
Section: Methodsmentioning
confidence: 99%
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