2009
DOI: 10.1063/1.3073963
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Heterodyne lock-in thermal coupling measurements in integrated circuits: Applications to test and characterization

Abstract: Heterodyne strategies can be used to characterize thermal coupling in integrated circuits when the electrical bandwidth of the dissipating circuit is beyond the bandwidth of the thermal coupling mechanism. From the characterization of the thermal coupling, two possible applications are described: extraction of characteristics of the dissipating circuit (the determination of the center frequency of a low-noise amplifier) and the extraction of the thermal coupling transfer function.

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Cited by 3 publications
(1 citation statement)
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“…To the best of the authors' knowledge, the use of temperature measurements to characterize analog circuits was first proposed in [16][17][18]. In this paper, we demonstrate that key small-signal (frequency response) and large-signal (linearity) parameters of RF circuits can be monitored by measuring the temperature with non-invasive temperature sensors embedded in the same silicon die.…”
Section: Introductionmentioning
confidence: 91%
“…To the best of the authors' knowledge, the use of temperature measurements to characterize analog circuits was first proposed in [16][17][18]. In this paper, we demonstrate that key small-signal (frequency response) and large-signal (linearity) parameters of RF circuits can be monitored by measuring the temperature with non-invasive temperature sensors embedded in the same silicon die.…”
Section: Introductionmentioning
confidence: 91%