2016
DOI: 10.1016/j.jmps.2016.05.020
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Helical coil buckling mechanism for a stiff nanowire on an elastomeric substrate

Abstract: When a stiff nanowire is deposited on a compliant soft substrate, it may buckle into a helical coil form when the system is compressed. Using theoretical and finite element method (FEM) analyses, the detailed three-dimensional coil buckling mechanism for a silicon nanowire (SiNW) on a poly-dimethylsiloxne (PDMS) substrate is studied. A continuum mechanics approach based on the minimization of the strain energy in the SiNW and elastomeric substrate is developed. Due to the helical buckling, the bending strain i… Show more

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Cited by 43 publications
(15 citation statements)
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“…This type of 2D-3D geometric transformation follows from a process of compressive buckling that can be analyzed quantitatively using a finite-deformation model 113 . Similar processes can form coiled nanowires 114-116 .…”
Section: Helical Designmentioning
confidence: 82%
“…This type of 2D-3D geometric transformation follows from a process of compressive buckling that can be analyzed quantitatively using a finite-deformation model 113 . Similar processes can form coiled nanowires 114-116 .…”
Section: Helical Designmentioning
confidence: 82%
“…Complex 3D buckling patterns, such as helical, spring-like, and so on, are feasible by compressing thin film or nanofibers on a soft substrate, which can be used to fabricate micro/nanostructures in extremely complex geometries. 37 Chen et al 38,39 studied the transition from the in-plane buckling to the helical buckling for the SiNW on the PDMS substrate (Fig. 7a, b).…”
Section: Mapping Electronics/structures Into 3d Complex Shapesmentioning
confidence: 99%
“…For instance, interface sliding was observed between Si NWs and PDMS substrate [245]; with surface treatment of the PDMS substrate, the static friction (interfacial strength) increased [81] and the interface sliding was largely suppressed. The interface sliding played an important role in the NW buckling shape [265,266]. Shear-lag models have been used to analyze the shear stress transfer between graphene and substrate [267,268], which can be extended to NWs and substrate too.…”
Section: Flexible and Stretchable Electronics Semiconductormentioning
confidence: 99%