Heat dissipation performance of metal-core printed circuit board prepared by anodic oxidation and electroless deposition

Lee, Junghoon; Kim, Junho; Kim, Donghyun; Chung, Wonsub

doi:10.1016/j.tca.2014.06.001

Cited by 11 publications

(4 citation statements)

References 38 publications

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“…[44] The conventional LEDs employ a metal core printed circuit board, a ceramic substrate, and a direct copper substrate for temperature management. [45,46] However, these substrates can only be made in a 2D manner and are suitable for mass production. Comparatively, with our multimaterial dispensing AM technology, customized LED circuitry with complex geometry can be developed in small batch rapidly and cost-efficiently.…”

Section: Demonstrators Of Multimaterials Dispensing Additive Manufact...mentioning

confidence: 99%

Multimaterial Additive Manufacturing of LTCC Matrix and Silver Conductors for 3D Ceramic Electronics

Wang

et al. 2022

Adv Materials Technologies

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Ceramic electronics have the advantages of large ampacity, high thermal conductivity, and excellent dielectric properties which are widely used in power electronics, optoelectronics, automotive industry, and aerospace technology. This work proposes a multimaterial dispensing additive manufacturing technology for customizing the 3D low‐temperature‐cofired ceramic (LTCC) circuitry. Customized LTCC aqueous slurry is first developed and then 3D printed together with commercial silver paste to build the green body. Then, the green body is debinded and sintered with a three‐stage process at 200, 500, and 850 °C, respectively. The shrinkage rate in 3D is around 17% which is comparable with commercial LTCCs. The surface quality of the sintered ceramic is improved obviously compared with that of the green body due to the glazing effect of the glass phase. For the silver conductor, the resistivity and the temperature coefficient of resistance are 2.34 ± 0.04 µΩ cm and 3.56 × 10−3 °C−1, respectively. A serial of demonstrators including 2D, 3D light‐emitting diode ceramic circuit boards and a ceramic heater/thermometer is developed to prove the potential and feasibility of the proposed technology.

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Section: Demonstrators Of Multimaterials Dispensing Additive Manufact...mentioning

confidence: 99%

Multimaterial Additive Manufacturing of LTCC Matrix and Silver Conductors for 3D Ceramic Electronics

Wang

et al. 2022

Adv Materials Technologies

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“…Compared with the traditional LED circuit board based on planar fabrication technologies such as a metal core printed circuit board (MC-PCB) and a direct plate copper (DPC) ceramic substrate, the developed 3D LED circuit board had bespoke geometries to meet the specific installation requests, and furthermore, multiple functionalities such as the electrical module and the thermal management module can be customized and integrated within the same product.…”

Section: Demonstratorsmentioning

confidence: 99%

Selectively Metalizable Low-Temperature Cofired Ceramic for Three-Dimensional Electronics via Hybrid Additive Manufacturing

Wang

et al. 2022

ACS Appl. Mater. Interfaces

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With increasing interest in the rapid development of customized ceramic electronics, hybrid additive manufacturing (HAM) technology has become a competent alternative to traditional solutions such as printed circuit boards and cofired ceramic technology. Herein, the novel HAM technology is proposed by combining a dispensing three-dimensional (3D) printing process and selectively laser-activated electroless plating for fabricating 3D fully functional ceramic electronic products. An appropriative 3D-printable and metalizable low-temperature cofired ceramic slurry is developed to build the green body of ceramic electronics. After the debinding and sintering process, the 3D ceramic structure can be selectively laser-activated and then electrolessly plated to achieve electronic functionality. The thickness of the plated copper layer approaches 10 μm after 4 h of plating, and the electrical conductivity is 5.5 × 107 S m–1, which is close to pure copper (5.8 × 107 S m–1). To reduce the surface roughness of the laser-activated ceramic surface and thereby enhance the conductivity of the copper layer, the laser parameters are optimized as a 1250 mm s–1 scan speed, a 0.4 W laser power, and a 20 kHz laser-spot frequency. A high-power 3D light-emitting diode circuit board with an internal cooling channel is successfully developed to prove the feasibility of this HAM technology for customizing fully functional 3D conformal ceramic electronics.

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“…Aluminium based materials, have received great attention in the electronic industry, especially in the heat sink substrate of light emitting diode (LED) lamps [1][2][3], due to their advantages of high specific strength, proper corrosion resistance, as well as sound thermal conductivity. Typically, an LED heat sink substrate consists of three layers: aluminum alloy at the bottom, a copper circuit in the top, and various organic compounds have been used as middle layers to ensure insulation between them [4]. Nonetheless, poor thermal emissivity decrease the thermal dissipation efficiency of radiation [5].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of a Thick Crystalline Al2O3 Coating with Insulation and High Thermal Conductivity via Anodic Oxidation and Subsequent Mic Arc Discharge Treatment

Song

Jiang

2020

Coatings

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Amorphous Al2O3 coating with a thickness of 143 μm was firstly prepared by anodic oxidation, then the amorphous Al2O3 was transformed into crystalline Al2O3 through applying micro arc discharge. The crystal structure of the Al2O3 coatings was analyzed with an X-ray diffractometer. Results indicated that the coating consisted of amorphous and crystalline Al2O3. The microstructure of the coating was characterized by scanning electron microscopy, which showed that the coating had a compact structure. The thermal conductivity of the coating was 23.7 W/m·K, which is significantly higher than that of amorphous Al2O3 coating. The total and specific breakdown voltages of the coating were 3.85 kV and 26.92 kV/mm, which is suitable to apply for high power LED heat sink substrate.

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Heat dissipation performance of metal-core printed circuit board prepared by anodic oxidation and electroless deposition

Cited by 11 publications

References 38 publications

Multimaterial Additive Manufacturing of LTCC Matrix and Silver Conductors for 3D Ceramic Electronics

Multimaterial Additive Manufacturing of LTCC Matrix and Silver Conductors for 3D Ceramic Electronics

Selectively Metalizable Low-Temperature Cofired Ceramic for Three-Dimensional Electronics via Hybrid Additive Manufacturing

Fabrication of a Thick Crystalline Al2O3 Coating with Insulation and High Thermal Conductivity via Anodic Oxidation and Subsequent Mic Arc Discharge Treatment

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