Heat Conduction Enhancement of a Thermal Interface Material for Heat Sink Applications Using Carbon Nanomaterials

Mouane, Othmane; Sideras‐Haddad, E.; Nkadimeng, E. K.; Mckenzie, Ryan Peter; Rensburg, Roger van; Sandrock, C; Garcia, B. R. Mellado; Coville, Neil J.

doi:10.1109/tnano.2022.3186102

Cited by 3 publications

(1 citation statement)

References 21 publications

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“…Through theoretical calculations and experiments, interface thermal resistance has been effectively reduced. Therefore, this shift imposes greater demands on the thermal conductivity capabilities of thermal interface materials (TIMs) [3][4][5][6]. Silicone rubber (SIR) is widely selected as the matrix material for TIMs due to its wide viscosity range, adjustable hardness, high insulation, good filler compatibility, and excellent reliability [7][8][9].…”

Section: Introductionmentioning

confidence: 99%

Boron Nitride/Carbon Fiber High-Oriented Thermal Conductivity Material with Leaves–Branches Structure

Shu,

Sun,

Huang

et al. 2024

Materials

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In the realm of thermal interface materials (TIMs), high thermal conductivity and low density are key for effective thermal management and are particularly vital due to the growing compactness and lightweight nature of electronic devices. Efficient directional arrangement is a key control strategy to significantly improve thermal conductivity and comprehensive properties of thermal interface materials. In the present work, drawing inspiration from natural leaf and branch structures, a simple-to-implement approach for fabricating oriented thermal conductivity composites is introduced. Utilizing carbon fibers (CFs), known for their ultra-high thermal conductivity, as branches, this design ensures robust thermal conduction channels. Concurrently, boron nitride (BN) platelets, characterized by their substantial in-plane thermal conductivity, act as leaves. These components not only support the branches but also serve as junctions in the thermal conduction network. Remarkably, the composite achieves a thermal conductivity of 11.08 W/(m·K) with just an 11.1 wt% CF content and a 1.86 g/cm3 density. This study expands the methodologies for achieving highly oriented configurations of fibrous and flake materials, which provides a new design idea for preparing high-thermal conductivity and low-density thermal interface materials.

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Section: Introductionmentioning

confidence: 99%

Boron Nitride/Carbon Fiber High-Oriented Thermal Conductivity Material with Leaves–Branches Structure

Shu,

Sun,

Huang

et al. 2024

Materials

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Design of Thermal Interface Materials with Excellent Interfacial Heat/Force Transfer Ability via Hierarchical Energy Dissipation

Zeng,

Cheng

et al. 2024

Adv Funct Materials

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Interfaces play an important role in the heat and stress transfer within applications such as electronic cooling. The coexistence of apparently contradictory properties between heat dissipation and adhesion at interfaces poses a constant challenge for existing interface materials. Herein, a thermal interface material is reported, consisting of epoxy‐functionalized polydimethylsiloxane and aluminum fillers with excellent interfacial heat/force transfer ability. This material optimizes the combination of thermal conductivity of 3.46 W m−1 K−1 and adhesion energy of 1.17 kJ m−2. Using two viscoelastic models, the excellent interfacial force transfer ability is attributed to a hierarchical energy dissipation via the introduction of borate ester bonds and the aluminum filler networks. A simple kinetic bond model demonstrates that the borate ester bonds increase molecular chain segment mobility, allowing full extension at debonding interface for stress dispersion and efficient energy dissipation. The aluminum filler networks not only facilitate thermal transfer, but also dissipate the mechanical energy during filler network destruction due to the bond breakage between fillers. The excellent heat dispassion and mechanical stability are further demonstrated when this thermal interface material is used in flexible light emitting diodes and high‐power chips. This work provides a new strategy for balancing interfacial heat and force transfer.

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A Review of Techniques for Effective Thermal Management in Power Electronics

Orville,

Tajwar,

Bihani

et al. 2024

Preprint

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Heat Conduction Enhancement of a Thermal Interface Material for Heat Sink Applications Using Carbon Nanomaterials

Cited by 3 publications

References 21 publications

Boron Nitride/Carbon Fiber High-Oriented Thermal Conductivity Material with Leaves–Branches Structure

Boron Nitride/Carbon Fiber High-Oriented Thermal Conductivity Material with Leaves–Branches Structure

Design of Thermal Interface Materials with Excellent Interfacial Heat/Force Transfer Ability via Hierarchical Energy Dissipation

A Review of Techniques for Effective Thermal Management in Power Electronics

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