Boron Nitride/Carbon Fiber High-Oriented Thermal Conductivity Material with Leaves–Branches Structure
Dengfeng Shu,
Jiachen Sun,
Fei Huang
et al.
Abstract:In the realm of thermal interface materials (TIMs), high thermal conductivity and low density are key for effective thermal management and are particularly vital due to the growing compactness and lightweight nature of electronic devices. Efficient directional arrangement is a key control strategy to significantly improve thermal conductivity and comprehensive properties of thermal interface materials. In the present work, drawing inspiration from natural leaf and branch structures, a simple-to-implement appro… Show more
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