Harmonic and Random Vibration Durability of SAC305 and Sn37Pb Solder Alloys

Zhou, Yonglei; Al-Bassyiouni, Moustafa; Dasgupta, Abhijit

doi:10.1109/tcapt.2009.2036834

Cited by 42 publications

(19 citation statements)

References 12 publications

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“…Wu [12] and Li [13] presented the finite element modeling for the solder fatigue prediction under the random vibration of 0.55 g 2 /Hz, and the frequency range of 50-2000 Hz with 12 root mean square acceleration (grms), respectively. Some studies combined the sinusoidal and random vibration [14], or additionally combined the thermal loadings [15,16]. The packaging structure adopted for the tests in the previous literatures were mostly plastic ball grid array (PBGA), presumably due to the fact that the package is one of the most common types in the commercial market.…”

Section: Introductionmentioning

confidence: 99%

PBGA packaging reliability assessments under random vibrations for space applications

Kim

Hwang

2015

Microelectronics Reliability

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Section: Introductionmentioning

confidence: 99%

PBGA packaging reliability assessments under random vibrations for space applications

Kim

Hwang

2015

Microelectronics Reliability

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“…A significant number of studies have been published that discuss the reliability of various electronic assemblies and packages subjected to four-point bend testing. [1][2][3][4][5][6][7][8][9][10][11] All these studies were carried out at cyclic frequencies between 1 Hz and 3 Hz and, as such, do not account for the timedependent (creep) behavior of solder interconnects. However, as seen in the literature, 12-14 a significant amount of creep can occur in solders even at room temperature.…”

Section: Introductionmentioning

confidence: 99%

Evaluating the Impact of Dwell Time on Solder Interconnect Durability Under Bending Loads

Menon

Osterman

Pecht

2015

Journal of Elec Materi

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With the increasing portability and miniaturization of modern-day electronics, the mechanical robustness of these systems has become more of a concern. Existing standards for conducting mechanical durability tests of electronic assemblies include bend, shock/drop, vibration, and torsion. Although these standards provide insights into both cyclic fatigue and overstress damage incurred in solder interconnects (widely regarded as the primary mode of failure in electronic assemblies), they fail to address the impact of timedependent (creep) behavior due to sustained mechanical loads on solder interconnect durability. It has been seen in previous studies that solder durability under thermal cycling loads is inversely proportional to the dwell time or hold time at either temperature extreme of the imposed temperature cycle. Fatigue life models, which include dwell time, have been developed for solder interconnects subject to temperature cycling. However, the fatigue life models that have been developed in the literature for solder interconnects under mechanical loads fail to address the influence of the duration of loading. In this study, solder interconnect test vehicles were subjected to cyclic mechanical bending with various dwell times in order to understand the impact of the duration of mechanical loads on solder interconnect durability. The solder interconnects examined in this study were formed with 2512 resistor packages using various solder compositions [tin-lead (Sn-Pb) and 96.5Sn-3Ag-0.5Cu (SAC305)]. To evaluate the impact of dwell time, the boards were tested with 0 s, 60 s, and 300 s of dwell time at both extremes of the loading profile. It was observed that an increase in the dwell time of the loading profile resulted in a decrease in the characteristic life of the solder interconnects. The decrease in fatigue life was attributed to increased creep damage as identified using finite-element simulations. An energy partitioning approach was then used to estimate the mean cycles to failure for the various testing conditions. The estimated mean cycles to failure were within 10% of the experimentally obtained mean cycles to failure.

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“…Vibration test methods have been widely used to evaluate the solder interconnects reliability. To produce large amplitude vibration loading, some test methods apply constant vibrating frequency at 1st eigenmode of the PCB [1][2][3]. Equivalent strain amplitude can be obtained by adjusting resonant vibration condition to be in accordance with JESD22-B111 standard for drop impact test [4].…”

Section: Introductionmentioning

confidence: 99%

“…Even the boards with the same dimension, layer structure and materials, can be different for different lots or manufacturers. Some vibration methods are proposed to set random vibration within a frequency band [2,5,6], which cover the eigenfrequency interval and induce the largest loading amplitude. However, evaluating reliability with different test methods require good understanding about the similarities and differences of these methods.…”

Section: Introductionmentioning

confidence: 99%

Evaluating board level solder interconnects reliability using vibration test methods

Liu

Sun

Zhang

et al. 2014

Microelectronics Reliability

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Harmonic and Random Vibration Durability of SAC305 and Sn37Pb Solder Alloys

Cited by 42 publications

References 12 publications

PBGA packaging reliability assessments under random vibrations for space applications

PBGA packaging reliability assessments under random vibrations for space applications

Evaluating the Impact of Dwell Time on Solder Interconnect Durability Under Bending Loads

Evaluating board level solder interconnects reliability using vibration test methods

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