Evaluating board level solder interconnects reliability using vibration test methods

Liu, Yang; Sun, Fenglian; Zhang, Hongwu; Wang, J.; Zhou, Zhen

doi:10.1016/j.microrel.2014.07.058

Cited by 10 publications

(4 citation statements)

References 9 publications

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“…Similarly, Athamneh et al [70] performed reliability modeling of aged SAC305 solder joints and found the hazard rate to have shape parameters greater than 2. Liu et al [71] showed that the interconnects undergo wear-out when subjected to vibrations, both at fixed and random frequencies. Virkki and Tuukkanen [73] studied tantalum capacitors under various temperature ranges and observed only increasing failure rates.…”

Section: Wear-out Periodmentioning

confidence: 99%

An Assessment of Validity of the Bathtub Model Hazard Rate Trends in Electronics

et al. 2021

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The bathtub model has often been cited as a hazard rate profile that predicts not only human mortality but also the hazard rate of manufactured products. This paper examines the inapplicability of the bathtub model to predict the hazard rate of electronic components, products, and systems. The paper reviews various literature and uses numerous experiments and field failure data to support its argument. The factors affecting the hazard rate of electronics are then discussed, common hazard rate trends for electronics are identified, and recommendations for the assessment of hazard rates are given. This paper recommends that a preconceived model of hazard rate over time should not be used.

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Section: Wear-out Periodmentioning

confidence: 99%

An Assessment of Validity of the Bathtub Model Hazard Rate Trends in Electronics

et al. 2021

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“…Liu et al conducted a study to explore three accelerated test methods for evaluating the mechanical reliability of printed circuit boards (PCBs) at the board level using vibration loadings [5]. The first method employed fixed-frequency sine vibration, while the second method utilised swept sine vibration within a limited frequency range.…”

Section: Introductionmentioning

confidence: 99%

Response Surface Optimisation of the Mechanical Shock Testing for Advanced Ball Grid Array Package

Muhammad Syahmi Ahmad Tamili

2023

ASET

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This research focuses on optimising mechanical shock testing for advanced ball grid array (BGA) packages using finite element analysis. This research aims to analyse the parameters in mechanical shock testing for advanced BGA packages and optimise their mechanical strength using Response Surface Methodology (RSM). This research employs two methods: Finite Element Analysis and RSM. The methodology involves investigating three parameters: impact frequency, stand-off height, and solder ball diameter through numerical experimentation. Three responses, namely stress, strain, and displacement, are obtained to achieve an optimal result using RSM. The numerical experiments are conducted using finite element software, specifically on advanced BGA packages. The findings of this study contribute to result optimisation and provide an understanding of the most significant parameters and responses. High displacement affects neighbouring circuit board parts and solder joints, leading to broken links and connections. Besides, high acceleration could lead to loose bolts, relay chattering, and slipping of the variable resistor in integrated circuit (IC) packages. The validation process is performed to verify the results obtained from the numerical experiments.

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“…To produce large vibration amplitude, some methods apply constant vibration frequency at the 1st eigenfrequency of PCB [4][5][6]. And the other methods are also proposed to conduct vibration with swept frequency or random [5,7,8] within the frequency range, which covers the 1st eigenfrequency. And frequency responses of the PCB are mainly dependent on environmental temperature.…”

Section: Introductionmentioning

confidence: 99%

Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading

Zhang

Liu

Wang

et al. 2015

Microelectronics Reliability

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Evaluating board level solder interconnects reliability using vibration test methods

Cited by 10 publications

References 9 publications

An Assessment of Validity of the Bathtub Model Hazard Rate Trends in Electronics

An Assessment of Validity of the Bathtub Model Hazard Rate Trends in Electronics

Response Surface Optimisation of the Mechanical Shock Testing for Advanced Ball Grid Array Package

Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading

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