Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading

Zhang, H. W.; Liu, Yang; Wang, J.; Sun, Fenglian

doi:10.1016/j.microrel.2015.07.033

Cited by 21 publications

(3 citation statements)

References 16 publications

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“…Notably, during the temperature ascending from 0 • C to 70 • C, the maximum fluctuation range can extend up to 20%, directly affecting the line delay and signal frequency. [24] In recent years, to meet the need to develop the miniaturization and high density of electronic products, a flexible PCB has emerged, which has the advantages of small size, lightweight and easy bending. [25] It is thermally stable at temperature of up to 280 • C for half an hour.…”

Section: Simulation Design Of Conformal Antennamentioning

confidence: 99%

Design of compact integrated diamond nitrogen–vacancy center quantum probe

Xia 夏,

Lu 卢,

Zhao 赵

et al. 2024

Chinese Phys. B

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In this work, an integrated quantum probe for magnetic field imaging is proposed, where the nitrogen-vacancy (NV) center affixed to the fiber tip is positioned at the periphery of a flexible ring resonator. Employing flexible polyimide (PI) as the substrate medium, we have designed a circular microstrip antenna, which realizes the 140 MHz bandwidth under the Zeeman splitting frequency of 2.87 GHz, specifically tailored for NV center experiments. Subsequently, this antenna is seamlessly affixed to a 3D-printed cylindrical support, allowing the optical fiber tip to extend out of a dedicated aperture. To mitigate errors originating from processing, precise tuning within a narrow range can be achieved by adjusting the conformal amplitude. Finally, we perform high-resolution imaging of the microwave magnetic field surrounding the integrated probe and determine the suitable area for placing the fiber tip (SAP).

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Section: Simulation Design Of Conformal Antennamentioning

confidence: 99%

Design of compact integrated diamond nitrogen–vacancy center quantum probe

Xia 夏,

Lu 卢,

Zhao 赵

et al. 2024

Chinese Phys. B

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show abstract

“…For condensation, the dew point range and the size of dew droplet formation on the PCB surface are affected by climatic conditions [51]. Climatic conditions can also influence in increasing the absolute humidity (AH) to interact with PCB surface, reducing the deliquescent relative humidity (RH) level and increasing solubility for contamination, and extending the deposition process for ECM through the increasing electrochemical process [52,53]. The levels of both temperature and RH have proportional with the actual environment and deliquescence of solder flux activators [54].…”

Section: Climatic Conditionsmentioning

confidence: 99%

Using machine learning algorithms to predict failure on the PCB surface under corrosive conditions

2022

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“…These environmental factors, such as temperature and moisture, cause delamination between layers and material crack inside the PCB. Some literatures investigated the effect of these factors, including studying the temperature effect by thermal cycling [Zhang, Ding and Sheng (2009); Zhang, Liu, Wang et al (2015)]. On the other hand, the impact drop test for PCB is quite important before mass production for the development of PCB, especially for application of portable products.…”

Section: Introductionmentioning

confidence: 99%

Stress Analysis of Printed Circuit Board with Different Thickness and Composite Materials Under Shock Loading

Liu¹,

Lu²,

Tai³

et al. 2020

Computer Modeling in Engineering &Amp; Sciences

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In this study, the deformation and stress distribution of printed circuit board (PCB) with different thickness and composite materials under a shock loading were analyzed by the finite element analysis. The standard 8-layer PCB subjected to a shock loading 1500 g was evaluated first. Moreover, the finite element models of the PCB with different thickness by stacking various number of layers were discussed. In addition to changing thickness, the core material of PCB was replaced from woven E-glass/epoxy to woven carbon fiber/epoxy for structural enhancement. The non-linear material property of copper foil was considered in the analysis. The results indicated that a thicker PCB has lower stress in the copper foil in PCBs under the shock loading. The stress difference between the thicker PCB (2.6 mm) and thinner PCB (0.6 mm) is around 5%. Using woven carbon fiber/epoxy as core material could lower the stress of copper foil around 6.6% under the shock loading 1500 g for the PCB with 0.6 mm thickness. On the other hand, the stress level is under the failure strength of PCBs with carbon fiber/epoxy core layers and thickness 2.6 mm when the peak acceleration changes from 1500 g to 5000 g. This study could provide a reference for the design and proper applications of the PCB with different thickness and composite materials.

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Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading

Cited by 21 publications

References 16 publications

Design of compact integrated diamond nitrogen–vacancy center quantum probe

Design of compact integrated diamond nitrogen–vacancy center quantum probe

Using machine learning algorithms to predict failure on the PCB surface under corrosive conditions

Stress Analysis of Printed Circuit Board with Different Thickness and Composite Materials Under Shock Loading

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