HAMR Thermal Modeling Including Media Hot Spot

Huang, Lixi; Stipe, B. C.; Staffaroni, Matteo; Juang, Jia-Yang; Hirano, T.; Schreck, Erhard; Huang, Fu-Ying

doi:10.1109/tmag.2013.2252886

Cited by 26 publications

(19 citation statements)

References 7 publications

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“…In this technology, a near-field transducer (NFT) heats the magnetic media in a localized region (∼ 50 nm) through the delivery of electromagnetic radiation focused by a gold (Au)-dielectric plasmonic interface. [5][6][7] Heat generated due to parasitic losses in the Au itself is dissipated to the dielectric and results in peak NFT temperatures hundreds of degrees above the ambient temperature. 5 High thermal conductivity dielectrics such as aluminum nitride (AlN) or sapphire (Al 2 O 3 ) would be preferred, therein making their interface with Au the clear bottleneck to heat dissipation.…”

Section: Introductionmentioning

confidence: 99%

Enhancement of Thermal Conductance at Metal-Dielectric Interfaces Using Subnanometer Metal Adhesion Layers

et al. 2016

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We show that the use of sub-nm adhesion layers significantly enhances the thermal interface conductance at metal-dielectric interfaces. A metal-dielectric interface between Au and sapphire (Al 2 O 3 ) was considered using Cu (low optical loss) and Cr (high optical loss) as adhesion layers. To enable high throughput measurements each adhesion layer was deposited as a wedge such that a continuous range of thickness could be sampled. Our measurements of thermal interface conductance at the metal-Al 2 O 3 interface made using frequency domain thermoreflectance show that a 1 nm thick adhesion layer of Cu or Cr is sufficient to enhance the thermal interface conductance by more than a factor of 2 or 4, respectively, relative to the pure Au-Al 2 O 3 interface. The enhancement agrees with the Diffuse Mismatch Model-based predictions of accumulated thermal conductance versus adhesion layer thickness assuming that it contributes phonons with wavelengths less than its adhesion layer thickness, while those with longer wavelengths transmit directly from the Au.

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Section: Introductionmentioning

confidence: 99%

Enhancement of Thermal Conductance at Metal-Dielectric Interfaces Using Subnanometer Metal Adhesion Layers

et al. 2016

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“…For example, in heat-assisted magnetic recording (HAMR), a promising next generation data storage technology [15], a gold (Au) near field transducer (NFT) is used to generate plasmons that locally heat regions of the magnetic media [16,17]. Plasmons driven along the Au-dielectric interface generate heat in the Au, which must be dissipated across the interface and into the surrounding dielectric [16].…”

mentioning

confidence: 99%

Thermal interface conductance across metal alloy–dielectric interfaces

Freedman

Davis

et al. 2016

Phys. Rev. B

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“…Dirichlet boundary condition (T = 0 • C) is applied at all boundaries except for the symmetry plane, which is a reasonable assumption considering the spot size (∼50 nm) and the temperature elevation (∼600 • C). The laser power absorption profiles are extracted from electro-magnetic simulations, assuming 6 nm head-media spacing, 10,16,21 and applied as heat generation rate in the model. The approach has demonstrated good correlations with Full Width at Half Maximum (FWHM) measurements.…”

Section: Numerical Modelingmentioning

confidence: 99%

“…11,12 On the other hand, numerical modeling provides a viable way to characterize media thermal responses and provide guidelines for experiments. [13][14][15][16][17] In these studies, laser heating is treated either as flux boundary conditions at the surface or as absorbed power determined by the Maxwell equation, with only the latter capturing the physics of energy propagation in the multilayer films. Temperature profiles are solved based on either the continuum Fourier equation or Boltzmann transport equation.…”

Section: Introductionmentioning

confidence: 99%

Thermal analysis of continuous and patterned multilayer films in the presence of a nanoscale hot spot

Juang

Zheng

2016

AIP Advances

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Thermal responses of multilayer films play essential roles in state-of-the-art electronic systems, such as photo/micro-electronic devices, data storage systems, and silicon-on-insulator transistors. In this paper, we focus on the thermal aspects of multilayer films in the presence of a nanoscale hot spot induced by near field laser heating. The problem is set up in the scenario of heat assisted magnetic recording (HAMR), the next-generation technology to overcome the data storage density limit imposed by superparamagnetism. We characterized thermal responses of both continuous and patterned multilayer media films using transient thermal modeling. We observed that material configurations, in particular, the thermal barriers at the material layer interfaces crucially impact the temperature field hence play a key role in determining the hot spot geometry, transient response and power consumption. With a representative generic media model, we further explored the possibility of optimizing thermal performances by designing layers of heat sink and thermal barrier. The modeling approach demonstrates an effective way to characterize thermal behaviors of micro and nano-scale electronic devices with multilayer thin film structures. The insights into the thermal transport scheme will be critical for design and operations of such electronic devices.

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HAMR Thermal Modeling Including Media Hot Spot

Cited by 26 publications

References 7 publications

Enhancement of Thermal Conductance at Metal-Dielectric Interfaces Using Subnanometer Metal Adhesion Layers

Enhancement of Thermal Conductance at Metal-Dielectric Interfaces Using Subnanometer Metal Adhesion Layers

Thermal interface conductance across metal alloy–dielectric interfaces

Thermal analysis of continuous and patterned multilayer films in the presence of a nanoscale hot spot

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