Thermal interface conductance across metal alloy–dielectric interfaces

Freedman, Justin P.; Yu, Xiaoxiao; Davis, R. F.; Gellman, Andrew J.; Malen, Jonathan A.

doi:10.1103/physrevb.93.035309

Cited by 20 publications

(17 citation statements)

References 60 publications

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“…Kapitza conductance is extremely dependent on the structural details of the interface at the nanoscale since the characteristic dimensions are comparable to or less than the vibrational mean‐free paths. Nanostructuring at the interface has been efficiently used to tune the energy transport pathways across interfacial regions either by introducing roughness, nonplanar features, interface mixing, or by functionalizing the interface to alter the stiffness of the bonds …”

Section: Effect Of Nanostructuring and Surface Functionalizationmentioning

confidence: 99%

A Review of Experimental and Computational Advances in Thermal Boundary Conductance and Nanoscale Thermal Transport across Solid Interfaces

Giri

Hopkins

2019

Adv Funct Materials

180

148

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Interfacial thermal resistance is the primary impediment to heat flow in materials and devices as characteristic lengths become comparable to the mean‐free paths of the energy carriers. This thermal boundary conductance across solid interfaces at the nanoscale can affect a plethora of applications. The recent experimental and computational advances that have led to significant atomistic insights into the nanoscopic thermal transport mechanisms at interfaces between various types of materials are summarized. The authors focus on discussions of works that have pushed the limits to interfacial heat transfer and drastically increased the understanding of thermal boundary conductance on the atomic and nanometer scales near solid/solid interfaces. Specifically, the role of localized interfacial modes on the energy conversion processes occurring at interfaces is emphasized in this review. The authors also focus on experiments and computational works that have challenged the traditionally used phonon gas models in interpreting the physical mechanisms driving interfacial energy transport. Finally, the authors discuss the future directions and avenues of research that can further the knowledge of heat transfer across systems with broken symmetries.

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Section: Effect Of Nanostructuring and Surface Functionalizationmentioning

confidence: 99%

A Review of Experimental and Computational Advances in Thermal Boundary Conductance and Nanoscale Thermal Transport across Solid Interfaces

Giri

Hopkins

2019

Adv Funct Materials

180

148

View full text Add to dashboard Cite

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“…As shown in Figure 19, the TDTR signal is dominantly determined by the interfacial thermal conductance when delay time is longer than 2 ns. TDTR technique is therefore implemented extensively to study the thermal transport mechanisms across interfaces, including the effect of surface chemistry on interfacial thermal conductance across functionalized liquid-solid boundary [95,117,118] and solid-solid interfaces [119], interfacial thermal conductance between metals and dielectrics, [120][121][122][123][124] and interface between low dimensional materials and bulk substrates [125][126][127] Let's consider bulk materials first to introduce the physical picture we based on to determine heat capacity and thermal conductivity simultaneously. Under periodic laser heating, the penetration depth is defined as a characteristic length which describes the depth of temperature gradient penetrates into the sample can be written as , = √2 / 0 where 0 is the modulation frequency, is volumetric heat capacity and the index of directions corresponds to in-plane ( = ) and cross-plane ( = ) respectively.…”

Section: Transient Thermoreflectance Techniquementioning

confidence: 99%

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Zhao

Qian

et al. 2016

Journal of Electronic Packaging

359

212

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Thermal conductivity and interfacial thermal conductance play crucial roles in the design of engineering systems where temperature and thermal stress are of concerns. To date, a variety of measurement techniques are available for both bulk and thin film solid-state materials with a broad temperature range. For thermal characterization of bulk material, the steady-state method, transient hot-wire method, laser flash diffusivity method, and transient plane source method are most used.For thin film measurement, the 3ω method and the transient thermoreflectance technique including both time-domain and frequency-domain analysis are widely employed. This work reviews several most commonly used measurement techniques. In general, it is a very challenging task to determine thermal conductivity and interfacial thermal conductance with less than 5% error.Selecting a specific measurement technique to characterize thermal properties needs to be based on: 1) knowledge on the sample whose thermophysical properties is to be determined, including the sample geometry and size, and the material preparation method; 2) understanding of fundamentals and procedures of the testing technique, for example, some techniques are limited to samples with specific geometries and some are limited to a specific range of thermophysical properties; 3) understanding of the potential error sources which might affect the final results, for example, the convection and radiation heat losses.

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“…where the constants are [7]. Following Jeong et al's approach to calculating G for adhesion layers, we treat phonon wavelengths smaller than the thickness of the adhesion layer as being transmitted from the adhesion layer to the dielectric, and larger wavelengths as being transmitted from the Au layer directly into the Al 2 O 3 [2].…”

Section: A Interdiffusion Composition Modellingmentioning

confidence: 99%

“…Adding as little as 1. interfaces, the value of G decreases as the Au content, x, increases [7]. While those two works quantify G at the extremes of interdiffusion (no interdiffusion and complete interdiffusion), it is unknown how an intermediate value of interdiffusion would affect G, despite its potential to compromise the thermal benefits of adhesion layers over the lifetime of a device.…”

Section: Introductionmentioning

confidence: 99%

Impact of metal adhesion layer diffusion on thermal interface conductance

Saha

Jeong

et al. 2019

Phys. Rev. B

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The first systematic measurements on the impact of interdiffusion between a metal overlayer and adhesion layer on the thermal interface conductance (G) at the metal bilayerdielectric interface are reported. Composition depth profiles quantify the interdiffusion of a Au-Cu bilayer as a function of Cu adhesion layer thickness (0-10 nm), annealing time, and annealing temperature. Optical pump/probe measurements of G quantify the effect of Au-Cu interdiffusion on thermal transport across the (Au-Cu)-Al 2 O 3 interface. The enhancement of G between Au and Al 2 O 3 through the addition of a Cu adhesion layer decreases as Au-Cu interdiffusion occurs. For example, annealing a 41 nm Au film with a 4.7 nm Cu adhesion layer on Al 2 O 3 at 520 K for 30 minutes, results in a 52 ±16% drop in G. An analytical model of the composition profile is derived with inputs of annealing time, temperature dependent permeabilities of the Au-Cu interface to each species, and the initial thicknesses of the Au and Cu layers. Integrating this model with a Diffuse Mismatch Model defines a new methodology for the prediction of G that accounts for interdiffusion in metal bilayers on dielectric substrates, and can be used to evaluate the degradation of G over a device's lifetime.

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Thermal interface conductance across metal alloy–dielectric interfaces

Abstract: We present the first measurements of thermal interface conductance as a function of metal alloy composition. Composition spread alloy films of

Cited by 20 publications

References 60 publications

A Review of Experimental and Computational Advances in Thermal Boundary Conductance and Nanoscale Thermal Transport across Solid Interfaces

A Review of Experimental and Computational Advances in Thermal Boundary Conductance and Nanoscale Thermal Transport across Solid Interfaces

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Impact of metal adhesion layer diffusion on thermal interface conductance

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