2001
DOI: 10.1016/s0921-4526(01)00851-1
|View full text |Cite
|
Sign up to set email alerts
|

Hall effect and surface characterization of Cu2S and CuS films deposited by RF reactive sputtering

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

9
41
0

Year Published

2012
2012
2022
2022

Publication Types

Select...
9

Relationship

0
9

Authors

Journals

citations
Cited by 77 publications
(50 citation statements)
references
References 7 publications
9
41
0
Order By: Relevance
“…At the same time the resistivity decreases. A stepwise lower sheet resistance and lower specific resistivity was observed by the stoichiometric change from Cu 2 S to finally CuS in other articles, respectively [36,37]. After reaching the percolation threshold p c the conductance increase slows down.…”
Section: Discussionmentioning
confidence: 82%
“…At the same time the resistivity decreases. A stepwise lower sheet resistance and lower specific resistivity was observed by the stoichiometric change from Cu 2 S to finally CuS in other articles, respectively [36,37]. After reaching the percolation threshold p c the conductance increase slows down.…”
Section: Discussionmentioning
confidence: 82%
“…The resistivities of thin films were low if the annealing temperature is under 300 o C. This is due to growing CuS(10 -4 Ωcm) [9] crystal which is one of conductor. CuS crystal was decreased by increase of annealing temperature.…”
Section: Resultsmentioning
confidence: 99%
“…Different methods of production of copper (I) sulfide layers are known: solid phase reaction [1], pyrolysis [2,3], sputtering [4], photochemical method [5,6], chemical deposition from aqueous solutions [7,8], vacuum vaporization [9]. Method of synthesis has a significant influence on the variety of film phase states: from Cu2S to CuS2 [10], and therefore -on the structure and morphology of their surface.…”
Section: Introductionmentioning
confidence: 99%