“…Copper is often employed as the metallization material in MEMS likewise in advanced integrated circuits because of its higher resistance to failure by electro-and stress-migration, as well as its large conductivity and plentiful supplement for noble metals. The volume resistivity of bulk copper at room temperature is 1.7 × 10 −8 m, whereas that of film and wire is nearly twice that value [3,4]. The origin of the resistivity is represented as additions of scattering processes of conduction electrons by phonons, impurities (O, S, P and Fe atoms) [5,6], vacancies, grain boundaries of polycrystalline film [7] and surface roughness [8], known as Matthiessen's rule [9].…”