2016
DOI: 10.1016/j.surfcoat.2016.06.099
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Growth, structural and mechanical properties of magnetron-sputtered ZrN/SiNx nanolaminated coatings

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Cited by 37 publications
(26 citation statements)
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“…Seo et al [3] reported a high hardness value of 25.2 GPa for epitaxial HfN(001) layers. As Si was introduced successively into the coatings, the hardness varied: the Hf48Si3N49 coatings had a hardness of 22.5 ± 0.8 GPa, whereas the hardness decreased sharply to 15.3 ± 0.6 GPa for the Hf46Si7N48 coatings and then remained at 15-16 GPa for the Hf39Si12N49, Hf36Si13N51 and Hf32Si19N49 coatings; this level is close to 17-19 GPa for Si3N4 [31][32][33][34]. The bonding characteristics of three typical Hf-Si-N coatings, a crystalline and amorphous mixed Hf48Si3N49, an X-ray amorphous dominated Hf45Si7N48 and an X-ray amorphous Hf32Si19N49 coatings, respectively representing low-, medium-and high-Si-contents Hf-Si-N coatings, were analyzed.…”
Section: Multilayered Hf-si-n Coatingsmentioning
confidence: 84%
“…Seo et al [3] reported a high hardness value of 25.2 GPa for epitaxial HfN(001) layers. As Si was introduced successively into the coatings, the hardness varied: the Hf48Si3N49 coatings had a hardness of 22.5 ± 0.8 GPa, whereas the hardness decreased sharply to 15.3 ± 0.6 GPa for the Hf46Si7N48 coatings and then remained at 15-16 GPa for the Hf39Si12N49, Hf36Si13N51 and Hf32Si19N49 coatings; this level is close to 17-19 GPa for Si3N4 [31][32][33][34]. The bonding characteristics of three typical Hf-Si-N coatings, a crystalline and amorphous mixed Hf48Si3N49, an X-ray amorphous dominated Hf45Si7N48 and an X-ray amorphous Hf32Si19N49 coatings, respectively representing low-, medium-and high-Si-contents Hf-Si-N coatings, were analyzed.…”
Section: Multilayered Hf-si-n Coatingsmentioning
confidence: 84%
“…One can also notice from the results in Figure 3 that the stress state is reproducible from one bilayer to another, i.e., there is no influence of the underneath layers on the cumulative stress build-up. The formation of compressive stress in sputter-deposited TMN layers is due to energetic bombardment during growth, which creates point defects in the crystal lattice and densify the grain boundaries [23,[35][36][37]. At low deposited energy, sputter-deposited MeN x films develop a columnar, underdense microstructure, often accompanied by the development of tensile stress [35,37,38].…”
Section: Resultsmentioning
confidence: 99%
“…The periodic growth of the multilayered systems was Coatings 2020, 10, 149 4 of 17 monitored by computer-controlled pneumatic shutters located at 2 cm in front of each target. Details of the multilayered films growth procedure are given in [23]. The deposition conditions are summarized in Table 1 for the reference monolithic films, and the same conditions were used for elementary layers of the MeN/SiN x (Me = Zr, Cr, Al) multilayers, except the deposition time.…”
Section: Methodsmentioning
confidence: 99%
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